IRDC3831 International Rectifier, IRDC3831 Datasheet - Page 29

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IRDC3831

Manufacturer Part Number
IRDC3831
Description
BOARD EVAL SYNC BUCK CONVERTER
Manufacturer
International Rectifier
Datasheets
IR3831MPbF
Solder Resist
It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder
resist should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure
NSMD pads.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder
resist onto the copper of 0.05mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to
the high aspect ratio of the solder resist strip separating the lead lands from the pad land.
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11/05/10

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