EVAL-AD5821EBZ Analog Devices Inc, EVAL-AD5821EBZ Datasheet - Page 15
![BOARD EVALUATION FOR AD5821](/photos/9/15/91594/eval-ad5821ebz_sml.jpg)
EVAL-AD5821EBZ
Manufacturer Part Number
EVAL-AD5821EBZ
Description
BOARD EVALUATION FOR AD5821
Manufacturer
Analog Devices Inc
Datasheet
1.AD5821ABCBZ-REEL7.pdf
(16 pages)
Specifications of EVAL-AD5821EBZ
Number Of Dac's
1
Number Of Bits
10
Outputs And Type
1, Single Ended
Sampling Rate (per Second)
400k
Data Interface
I²C
Settling Time
250µs
Dac Type
Current
Voltage Supply Source
Single
Operating Temperature
-30°C ~ 80°C
Utilized Ic / Part
AD5821
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD5821BCBZ-REEL7
AD5821BCBZ-REEL
AD5821-WAFER
AD5821D-WAFER
EVAL-AD5821EBZ
1
Z = Pb-free part.
IDENTIFIER
1
1
BALL 1
1
−40°C to +85°C
−40°C to +85°C
Temperature Range
−40°C to +85°C
−40°C to +85°C
(BALL SIDE DOWN)
TOP VIEW
1.575
1.515
1.455
Figure 27. 9-Ball Wafer Level Chip Scale Package [WLCSP]
Package Description
9-Ball Wafer Level Chip Scale Package (WLCSP)
9-Ball Wafer Level Chip Scale Package (WLCSP)
Bare Die Wafer
Bare Die Wafer on Film
Evaluation Board
1.750
1.690
1.630
Dimensions shown in millimeters
0.28
0.24
0.20
Rev. 0 | Page 15 of 16
(CB-9-1)
0.65
0.59
0.53
0.50 BSC
BALL PITCH
SEATING
PLANE
0.36
0.32
0.28
3
BOTTOM VIEW
(BALL SIDE UP)
2
Package Option
CB-9-1
CB-9-1
1
B
C
A
Branding
D82
D82
AD5821