NCP5030MTTXGEVB ON Semiconductor, NCP5030MTTXGEVB Datasheet - Page 4

• Manufacturer Part Number: NCP5030MTTXGEVB
• Description: EVAL BOARD FOR NCP5030MTTXG
• Manufacturer: ON Semiconductor

Specifications of NCP5030MTTXGEVB

• Design Resources: NCP5030MTTXG EVB BOM NCP5030MTTXGEVB Gerber Files NCP5030MTTXG EVB Schematic
• Current - Output / Channel: 900mA
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 2.2 ~ 5.5 V
• Features: Adjustable
• Voltage - Input: 2.7 ~ 5.5V
• Utilized Ic / Part: NCP5030
• Rohs Compliant: NO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP5030MTTXG
• Other names: NCP5030MTTXGEVBOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
2. According to JEDEC standard JESD22−A108B
3. This device series contains ESD protection and passes the following tests
4. Latchup Current Maximum Rating: ±100 mA per JEDEC standard: JESD78.
5. The thermal shutdown set to 160
6. For the 12−Pin 3x4 WDFN Package, the R
7. Per IPC/JEDEC standard: J−STD−020A.
MAXIMUM RATINGS
Power Supply Voltage (Note 2)
Over Voltage Protection
Human Body Model (HBM) ESD Rating (Note 3)
Machine Model (MM) ESD Rating (Note 3)
Digital Input Voltage
Digital Input Current
WDFN 3x4 Package
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Moisture Sensitivy Level (Note 7)
layer board and 43 for a four layer board.
Power Dissipation @ T
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air
Human Body Model (HBM) "2.0 kV per JEDEC standard: JESD22−A114 for all pins
Machine Model (MM) "200 V per JEDEC standard: JESD22−A115 for all pins
(Note 1)
A
= +85°C (Note 5)
Rating
°
C (typical) avoids irreversible damage on the device due to power dissipation.
qJA
is highly dependent on the PCB heat−sink area. For example, R
.
http://onsemi.com
4
ESD HBM
ESD MM
:
Symbol
T
CTRL
R
R
MSL
V
V
JMAX
T
P
T
T
qJC
qJA
bat
out
stg
D
A
J
−0.3 < V
Internally Limited
−40 to +125
−65 to +150
−40 to +85
(Note 6)
Value
in
+150
200
7.0
6.5
2.0
1.0
6.0
< V
1
A
bat
= 25°C.
qJA
+ 0.3
can be 57
°
C/W for a one
°C/W
°C/W
Unit
mA
kV
°C
°C
°C
°C
W
V
V
V
V