MCP1650DM-LED1 Microchip Technology, MCP1650DM-LED1 Datasheet - Page 21
![BOARD DEMO FOR MCP165X](/photos/24/6/240644/4650367_sml.jpg)
MCP1650DM-LED1
Manufacturer Part Number
MCP1650DM-LED1
Description
BOARD DEMO FOR MCP165X
Manufacturer
Microchip Technology
Specifications of MCP1650DM-LED1
Outputs And Type
1, Non-Isolated
Features
Dimmable
Voltage - Input
2 ~ 4.5V
Utilized Ic / Part
MCP1651
Core Chip
MCP1650
Topology
Boost
Output Current
700mA
Output Voltage
3.6V
No. Of Outputs
1
Input Voltage
2V To 4.5V
Kit Contents
Board
Development Tool Type
Hardware - Eval/Demo Board
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Current - Output / Channel
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Figure 6-2 represents the top wiring for the MCP1650/
51/52/53 application shown.
As shown in Figure 6-2, the high-current wiring is short
and wide. In this example, a 1 oz. copper layer is used
for both the top and bottom layers. The ground plane
connected to C2 and R4 are connected through the
vias (holes) connecting the top and bottom layer. The
feedback signal (from TP2) is wired from the output of
the regulator around the high current switching section
to the feedback voltage divider and to the FB pin of the
MCP1650/51/52/53.
FIGURE 6-2:
2004 Microchip Technology Inc.
Top Layer Wiring.
Figure 6-3 represents the bottom wiring for the
MCP1650/51/52/53 application shown.
Silk-screen reference designator labels are transparent
from the top of the board. The analog ground plane and
power ground plane are connected near the ground
connection of the input capacitor (C
high-power, ground-circulating currents from flowing
through the analog ground plane.
FIGURE 6-3:
MCP1650/51/52/53
Bottom Layer Wiring.
DS21876A-page 21
2
). This prevents