MCP1726EV Microchip Technology, MCP1726EV Datasheet - Page 20

• Manufacturer Part Number: MCP1726EV
• Description: BOARD EVAL FOR MCP1726
• Manufacturer: Microchip Technology

Specifications of MCP1726EV

• Channels Per Ic: 1 - Single
• Voltage - Output: 0.8 ~ 5V
• Current - Output: 1A
• Voltage - Input: 2.3 ~ 6V
• Regulator Type: Positive Adjustable
• Operating Temperature: -40°C ~ 125°C
• Board Type: Fully Populated
• Utilized Ic / Part: MCP1726
• Processor To Be Evaluated: MCP1726
• Silicon Manufacturer: Microchip
• Silicon Core Number: MCP1726
• Kit Application Type: Power Management - Voltage Regulator
• Application Sub Type: LDO
• Kit Contents: Board Cables CD Docs
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

MCP1726
Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below:
As you can see from the result, this application will be
operating very near the maximum operating junction
temperature of 125°C. The PCB layout for this
application is very important as it has a significant
impact on the junction-to-ambient thermal resistance
(Rθ
in this application.
Maximum Package Power Dissipation at
70°C Ambient Temperature
From this table you can see the difference in maximum
allowable power dissipation between the 3x3 DFN
package and the 8-pin SOIC package. This difference
is due to the exposed metal tab on the bottom of the
DFN package. The exposed tab of the DFN package
provides a very good thermal path from the die of the
LDO to the PCB. The PCB then acts like a heatsink,
providing more area to distribute the heat generated by
the LDO.
DS21936C-page 20
3x3 DFN (41° C/W Rθ
8LD SOIC (150°C/Watt Rθ
JA
P
P
P
P
) of the 3x3 DFN package, which is very important
D(MAX)
D(MAX)
D(MAX)
D(MAX)
T
T
T
= (125°C – 70°C) / 41° C/W
= 1.34W
= (125°C – 70°C)/ 150° C/W
= 0.366W
J
J
J
=
=
=
JA
)
T
48.8°C + 70.0°C
118.8°C
JRISE
JA
)
+ T
A(MAX)
© 2007 Microchip Technology Inc.