MCP6V01RD-TCPL Microchip Technology, MCP6V01RD-TCPL Datasheet - Page 25

• Manufacturer Part Number: MCP6V01RD-TCPL
• Description: REF DESIGN THERMCPL FOR MCP6V01
• Manufacturer: Microchip Technology

Specifications of MCP6V01RD-TCPL

• Channels Per Ic: 1 - Single
• Amplifier Type: Chopper (Zero-Drift)
• Output Type: Rail-to-Rail
• Slew Rate: 0.5 V/µs
• Current - Output / Channel: 22mA
• Operating Temperature: -40°C ~ 125°C
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Board Type: Fully Populated
• Utilized Ic / Part: MCP6V01
• Silicon Manufacturer: Microchip
• Silicon Core Number: MCP6V01
• Kit Application Type: Sensing - Temperature
• Application Sub Type: Temperature Sensor
• Processor To Be Evaluated: MCP6V01
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Current - Supply (main Ic): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4.3.8.4
The dual op amp amplifiers shown in
Figure 4-15
greater than 1, and a common mode gain of 1 .They
can use the layout shown in
ting resistors (R
bined so that the thermal voltages can be canceled.
The guard traces (with ground vias at the ends) help
minimize the thermal gradients. The resistor layout
cancels the resistor thermal voltages, assuming the
temperature gradient is constant in the region of the
resistors:
EQUATION 4-4:
FIGURE 4-11:
for Dual Non-inverting Amplifier.
© 2008 Microchip Technology Inc.
Where:
Thermal voltages are approximately equal
Note:
G
G
DM
CM
V
V
IA
IB
R1
R2
R3
=
=
Changing the orientation of the resistors
will usually cause a significant decrease in
the cancellation of the thermal voltages.
(V
(V
produce a non-inverting difference gain
Dual Non-inverting Amplifier Layout
for Thermo-junctions
½ MCP6V02
½ MCP6V02
OA
OA
1 + R
1, common mode gain
V
2
) between the two sides are not com-
OS
– V
+ V
is neglected
3
OB
V
OB
R
R
R
R
/R
OA
PCB Layout and Schematic
1
1
V
2
2
) ≈ (V
)/2 ≈ (V
2
U1
U
U
IA
, differential mode gain
1
1
V
V
Figure
IA
IB
OB
IA
R
R
– V
3
3
+ V
IB
4-11. The gain set-
)G
IB
Figure 4-14
)/2
DM
R1
R2
R3
V
V
OA
OB
and
4.3.8.5
In cases where an individual resistor needs to have its
thermo-junction voltage cancelled, it can be split into
two equal resistors as shown in
the thermal gradients near the resistors as small as
possible, the layouts are symmetrical with a ring of
metal around the outside. Make R
R
FIGURE 4-12:
Resistors.
Minimize temperature gradients at critical components
(resistors, op amps, heat sources, etc.):
• Minimize exposure to gradients
• Align with constant temperature (contour) lines
• Minimize magnitude of gradients
Make the temperature gradient point in one direction:
• Add guard traces
• Shape any FR4 gaps
2A
Note:
- Small components
- Tight spacing
- Shield from air currents
- Place on PCB center line
- Select parts with lower power dissipation
- Use same metal junctions on thermo-junc-
- Use metal junctions with low temperature to
- Large distance from heat sources
- Ground plane underneath (large area)
- FR4 gaps (no copper for thermal insulation)
- Series resistors inserted into traces (adds
- Use heat sinks
- Constant temperature curves follow the
- Connect to ground plane
- Constant temperature curves follow the
= R
tions that need to match
voltage coefficients
thermal and electrical resistance)
traces
edges
R
2B
1A
R
= 2R
1A
Changing the orientation of the resistors
will usually cause a significant decrease in
the cancellation of the thermal voltages.
Other PCB Thermal Design Tips
R
2
.
1B
R
MCP6V01/2/3
1B
PCB Layout for Individual
Figure
1A
R
R
DS22058B-page 25
2A
= R
2B
R
R
2A
2B
4-12. To keep
1B
= R
1
/2 and