MCP6V01RD-TCPL Microchip Technology, MCP6V01RD-TCPL Datasheet - Page 26

• Manufacturer Part Number: MCP6V01RD-TCPL
• Description: REF DESIGN THERMCPL FOR MCP6V01
• Manufacturer: Microchip Technology

Specifications of MCP6V01RD-TCPL

• Channels Per Ic: 1 - Single
• Amplifier Type: Chopper (Zero-Drift)
• Output Type: Rail-to-Rail
• Slew Rate: 0.5 V/µs
• Current - Output / Channel: 22mA
• Operating Temperature: -40°C ~ 125°C
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Board Type: Fully Populated
• Utilized Ic / Part: MCP6V01
• Silicon Manufacturer: Microchip
• Silicon Core Number: MCP6V01
• Kit Application Type: Sensing - Temperature
• Application Sub Type: Temperature Sensor
• Processor To Be Evaluated: MCP6V01
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Current - Supply (main Ic): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP6V01/2/3
4.3.8.6
DC crosstalk causes offsets that appear as a larger
input offset voltage. Common causes include:
• Common mode noise (remote sensors)
• Ground loops (current return paths)
• Power supply coupling
Interference from the mains (usually 50 Hz or 60 Hz),
and other AC sources, can also affect the DC perfor-
mance. Non-linear distortion can convert these signals
to multiple tones, included a DC shift in voltage. When
the signal is sampled by an ADC, these AC signals can
also be aliased to DC, causing an apparent shift in
offset.
To reduce interference:
4.3.8.7
Keep the resistances seen by the input pins as small
and as near to equal as possible to minimize bias cur-
rent related offsets.
Make the (trace) capacitances seen by the input pins
small and equal. This is helpful in minimizing switching
glitch-induced offset voltages.
Bending a coax cable with a radius that is too small
causes a small voltage drop to appear on the center or
(the tribo-electric effect). Make sure the bending radius
is large enough to keep the conductors and insulation
in full contact.
Mechanical stresses can make some capacitor types
(such as ceramic) to output small voltages. Use more
appropriate capacitor types in the signal path and
minimize mechanical stresses and vibration.
Humidity can cause electro-chemical potential voltages
to appear in a circuit. Proper PCB cleaning helps, as
does the use of encapsulants.
DS22058B-page 26
- Keep traces and wires as short as possible
- Use shielding (e.g., encapsulant)
- Use ground plane (at least a star ground)
- Place the input signal source near to the DUT
- Use good PCB layout techniques
- Use a separate power supply filter (bypass
capacitors) for these auto-zeroed op amps
Crosstalk
Miscellaneous Effects
4.4
4.4.1
Many sensors are configured as Wheatstone bridges.
Strain gauges and pressure sensors are two common
examples. These signals can be small and the
common mode noise large. Amplifier designs with high
differential gain are desirable.
Figure 4-13
bridge with a minimum of components. Because the
circuit is not symmetric, the ADC input is single ended,
and there is a minimum of filtering, the CMRR is good
enough for moderate common mode noise.
FIGURE 4-13:
Figure 4-14
Wheatstone bridges. This circuit is symmetric and has
high CMRR. Using a differential input to the ADC helps
with the CMRR.
FIGURE 4-14:
R R
R R
R R
R R
V
Typical Applications
DD
WHEATSTONE BRIDGE
shows how to interface to a Wheatstone
shows a higher performance circuit for
10 nF
10 nF
V
DD
0.2R
0.2R
Simple Design.
High Performance Design.
© 2008 Microchip Technology Inc.
1 µF
200Ω
200Ω
200 Ω
200 Ω
0.01C
100R
MCP6V0X
20 kΩ
20 kΩ
3 kΩ
1 µF
1 µF
3 kΩ
3 kΩ
½ MCP6V02
½ MCP6V02
ADC
V
DD
ADC
V
DD