INTRODUCTION
Fast and easy breadboarding of circuits using the PA162DK is possible with the EK68 evaluation kit. The EK68 in-
cludes the EVAL68 board. The use of EVAL68 allows for a large area of breadboarding space to work with while al-
lowing for the surface mount of PA162DK. The PA162DK amplifier may be surface mounted directly to the EVAL68.
The EK68 is designed for mounting of the PA162DK without the need to solder attach the device terminals. The
HS-33 heat sink is designed to hold the part in place while providing thermal control and electrical contact simul-
taneously. The obvious advantage is the ease of removal and replacement of the PA162DK as required. External
connection to the evaluation board can be made via the terminals at the edge of the circuit board.
PARTS LIST
Part#
EVAL68
PCE2055CT-ND
OX7R105KWN
HS33
146510CJ
571-0100
571-0500
MS06
Required assorted #4 hardware and thermal grease not included.
BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using ESD precaution.
• Review the Apex product datasheet and operating conditions.
• Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum junction
• Always use adequate power supply bypass capacitors, Apex recommends at least 10µF per amp of output cur-
• Do not change connections while the circuit is powered
• In case -Vs is disconnected before +Vs, a diode between -Vs and ground is recommended to avoid damage.
• Initially set all power supplies to the minimum operating levels allowed in the product datasheet.
• Check for oscillations up to and above the unity gain bandwidth of the amplifier.
ASSEMBLY
The PA162DK and capacitors are surface mount components and should be assembled to the EVAL68 using sur-
face mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. If a solder reflow furnace
is not available, a heat plate capable of solder reflow temperatures may be used. The heat slug on the back of the
PA162DK provides maximum heat dissipation capabilities when in direct contact to the heat sink. Thermal grease
should be used when mounting the heat sink to the evaluation board. Mating sockets strips are provided to facilitate
adding additional components as required. Please use care when handling and assembling the PA162DK. Make
certain that the package pin to pad alignment is correct and that the pins are seated on each pad. The PA162DK
heat slug and heat sink must be electrically connected to the most negative power supply potential (-Vs).
NOTE: All grounds must be tied together on the EVAL68 board.
EK68U
temperature (T
rent.
http://www.cirrus.com
J
P r o d u c t I n n o v a t i o n F r o m
P r o d u c t I n n o v a t i o n F r o m
) is not exceeded.
Description
Evaluation Board, PA162DK
CAP, 47uF, 50V
Cap, 200V, 1uF, Ceramic
Heat Sink
BNC Jacks
Banana Jacks
Banana Jacks
Mating Socket
Evaluation Kit for PA162DK
Copyright © Cirrus Logic, Inc. 2008
(All Rights Reserved)
Quantity
1
4
4
1
4
4
3
4
APEX − EK68REVA
AUGUST 2008
EK68
EK68