ATQT600 Atmel, ATQT600 Datasheet - Page 4

• Manufacturer Part Number: ATQT600
• Description: KIT EVAL TOUCH FOR QT600
• Manufacturer: Atmel
• Series: QTouch™r

Specifications of ATQT600

• Sensor Type: Touch Screen
• Interface: USB
• Embedded: Yes, Other
• Utilized Ic / Part: ATtiny88, ATmega324PA, ATxmega128A1
• Processor To Be Evaluated: ATtiny88, ATmega324, ATxmega128
• Data Bus Width: 8 bit, 16 bit
• Interface Type: USB
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 1.6 V to 3.6 V
• Silicon Manufacturer: Atmel
• Kit Application Type: Sensor
• Application Sub Type: Touch Sensor
• Kit Contents: USB Bridge, MCU Cards, Touchpad Cards
• Svhc: No SVHC (15-Dec-2010)
• Mcu Supported Families: ATtiny88,
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Sensitivity: -
• Sensing Range: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10620D–AT42–04/09
Table of Contents (Continued)
iv
Section 4
Mutual-capacitance Zero-dimensional Sensors ......................................................... 4-1
Section 5
Self-capacitance One-dimensional Sensors .............................................................. 5-1
4.1
4.2
4.3
5.1
5.2
5.3
Introduction ........................................................................................................................ 4-1
Planar Construction ........................................................................................................... 4-1
Non-Planar Construction.................................................................................................. 4-10
Introduction ........................................................................................................................ 5-1
General Advice .................................................................................................................. 5-1
Typical Spatially Interpolated Method ................................................................................ 5-3
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
4.2.8
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
4.3.7
4.3.8
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.3.1
5.3.2
Philipp Spring
Secondary Substrate Method ............................................................................ 3-10
Ground Loading ................................................................................................. 3-10
Illumination Effects............................................................................................. 3-10
Floating Conductive Items ................................................................................. 3-11
Conductive Paints.............................................................................................. 3-11
Introduction .......................................................................................................... 4-1
X and Y Electrodes .............................................................................................. 4-2
Ground Loading ................................................................................................... 4-6
Interconnection .................................................................................................... 4-7
Illumination Effects............................................................................................... 4-9
Floating Conductive Items ................................................................................... 4-9
Conductive Paints................................................................................................ 4-9
Transparent Y Electrodes .................................................................................... 4-9
Introduction ........................................................................................................ 4-10
Flooded-X Two-layer Method ............................................................................ 4-10
Spring Method ................................................................................................... 4-12
Adapting the Planar Construction For Distribution Across Two Layers ............. 4-13
Ground Loading ................................................................................................. 4-13
Illumination Effects............................................................................................. 4-13
Floating Conductive Items ................................................................................. 4-13
Conductive Paints.............................................................................................. 4-13
Ground Loading ................................................................................................... 5-1
Interconnection .................................................................................................... 5-1
Hand Shadow Effect ............................................................................................ 5-2
Floating Conductive Items ................................................................................... 5-2
Conductive Paints................................................................................................ 5-2
Introduction .......................................................................................................... 5-3
Small Slider Or Wheel ......................................................................................... 5-3
™
Method ....................................................................................... 3-8
Touch Sensors Design Guide