ATQT600 Atmel, ATQT600 Datasheet - Page 4
![KIT EVAL TOUCH FOR QT600](/photos/9/18/91802/qt600_sml.jpg)
ATQT600
Manufacturer Part Number
ATQT600
Description
KIT EVAL TOUCH FOR QT600
Manufacturer
Atmel
Series
QTouch™r
Specifications of ATQT600
Sensor Type
Touch Screen
Interface
USB
Embedded
Yes, Other
Utilized Ic / Part
ATtiny88, ATmega324PA, ATxmega128A1
Processor To Be Evaluated
ATtiny88, ATmega324, ATxmega128
Data Bus Width
8 bit, 16 bit
Interface Type
USB
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
1.6 V to 3.6 V
Silicon Manufacturer
Atmel
Kit Application Type
Sensor
Application Sub Type
Touch Sensor
Kit Contents
USB Bridge, MCU Cards, Touchpad Cards
Svhc
No SVHC (15-Dec-2010)
Mcu Supported Families
ATtiny88,
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Sensitivity
-
Sensing Range
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ATQT600
Manufacturer:
Atmel
Quantity:
135
10620D–AT42–04/09
Table of Contents (Continued)
iv
Section 4
Mutual-capacitance Zero-dimensional Sensors ......................................................... 4-1
Section 5
Self-capacitance One-dimensional Sensors .............................................................. 5-1
4.1
4.2
4.3
5.1
5.2
5.3
Introduction ........................................................................................................................ 4-1
Planar Construction ........................................................................................................... 4-1
Non-Planar Construction.................................................................................................. 4-10
Introduction ........................................................................................................................ 5-1
General Advice .................................................................................................................. 5-1
Typical Spatially Interpolated Method ................................................................................ 5-3
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.2.7
4.2.8
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
4.3.7
4.3.8
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.3.1
5.3.2
Philipp Spring
Secondary Substrate Method ............................................................................ 3-10
Ground Loading ................................................................................................. 3-10
Illumination Effects............................................................................................. 3-10
Floating Conductive Items ................................................................................. 3-11
Conductive Paints.............................................................................................. 3-11
Introduction .......................................................................................................... 4-1
X and Y Electrodes .............................................................................................. 4-2
Ground Loading ................................................................................................... 4-6
Interconnection .................................................................................................... 4-7
Illumination Effects............................................................................................... 4-9
Floating Conductive Items ................................................................................... 4-9
Conductive Paints................................................................................................ 4-9
Transparent Y Electrodes .................................................................................... 4-9
Introduction ........................................................................................................ 4-10
Flooded-X Two-layer Method ............................................................................ 4-10
Spring Method ................................................................................................... 4-12
Adapting the Planar Construction For Distribution Across Two Layers ............. 4-13
Ground Loading ................................................................................................. 4-13
Illumination Effects............................................................................................. 4-13
Floating Conductive Items ................................................................................. 4-13
Conductive Paints.............................................................................................. 4-13
Ground Loading ................................................................................................... 5-1
Interconnection .................................................................................................... 5-1
Hand Shadow Effect ............................................................................................ 5-2
Floating Conductive Items ................................................................................... 5-2
Conductive Paints................................................................................................ 5-2
Introduction .......................................................................................................... 5-3
Small Slider Or Wheel ......................................................................................... 5-3
™
Method ....................................................................................... 3-8
Touch Sensors Design Guide