101-0678 Rabbit Semiconductor, 101-0678 Datasheet - Page 80

• Manufacturer Part Number: 101-0678
• Description: KIT DEV RABBITCORE/RCM3600
• Manufacturer: Rabbit Semiconductor
• Series: RabbitCore 3000r
• Type: MPU Moduler

Specifications of 101-0678

• Rohs Status: RoHS non-compliant
• Contents: RabbitCore Module, Dev. Board, AC Adapter, Cable and Dynamic C® CD-Rom
• Processor To Be Evaluated: RCM3600
• For Use With/related Products: RCM3600
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 316-1037

The Prototyping Board comes with the basic components necessary to demonstrate the
operation of the RCM3600. Two LEDs (DS1 and DS2) are connected to PF6 and PF7, and
two switches (S1 and S2) are connected to PF4 and PB7 to demonstrate the interface to the
Rabbit 3000 microprocessor. Reset switch S3 is the hardware reset for the RCM3600.
The Prototyping Board provides the user with RCM3600 connection points brought out con-
veniently to labeled points at header J3 on the Prototyping Board. Although header J3 is
unstuffed, a 2 x 20 header is included in the bag of parts. RS-485 signals are available on
shrouded header J1, and RS-232 signals (Serial Ports C, D, and E) are available on header J2.
A header strip at J2 allows you to connect a ribbon cable. A shrouded header connector and
wiring harness are included with the Development Kit parts to help you access the RS-485 sig-
nals on shrouded header J1.
There is a 2.5" x 3" through-hole prototyping space available on the Prototyping Board.
The holes in the prototyping area are spaced at 0.1" (2.5 mm). +3.3 V, +5 V, and GND traces
run along both edges of the prototyping area for easy access. Small to medium circuits can
be prototyped using point-to-point wiring with 20 to 30 AWG wire between the prototyping
area, the +3.3 V, +5 V, and GND traces, and the surrounding area where surface-mount
components may be installed. Small holes are provided around the surface-mounted com-
ponents that may be installed around the prototyping area.
B.4.1 Adding Other Components
There are two sets of pads for 28-pin devices that can be used for surface-mount prototyp-
ing SOIC devices. (Although the adjacent sets of pads could accommodate up to a 56-pin
device, they do not allow for the overlap between two 28-pin devices.) There are also pads
that can be used for SMT resistors and capacitors in an 0805 SMT package. Each compo-
nent has every one of its pin pads connected to a hole in which a 30 AWG wire can be sol-
dered (standard wire wrap wire can be soldered in for point-to-point wiring on the
Prototyping Board). Because the traces are very thin, carefully determine which set of
holes is connected to which surface-mount pad.
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RabbitCore RCM3600