101-1050 Rabbit Semiconductor, 101-1050 Datasheet - Page 100

• Manufacturer Part Number: 101-1050
• Description: KIT DEV RABBITCORE RCM3750
• Manufacturer: Rabbit Semiconductor
• Series: RabbitCore 3000r
• Type: MPU Moduler

Specifications of 101-1050

• Contents: RabbitCore Module, Dev. Board, AC Adapter, Cable and Dynamic C® CD-Rom
• Processor To Be Evaluated: RCM3750
• Data Bus Width: 8 bit
• Interface Type: Ethernet
• For Use With/related Products: RCM3750
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 101-1049; 101-1049; 316-1117; Q2479714; Q2828455

The RCM3700 Prototyping Board comes with the basic components necessary to demon-
strate the operation of the RCM3750. Two LEDs (DS1 and DS2) are connected to PF6 and
PF7, and two switches (S1 and S2) are connected to PF4 and PB7 to demonstrate the inter-
face to the Rabbit 3000 microprocessor. Reset switch S3 is the hardware reset for the
RCM3750.
The RCM3700 Prototyping Board provides the user with RCM3750 connection points
brought out conveniently to labeled points at header J3 on the RCM3700 Prototyping Board.
Although header J3 is unstuffed, a 2 × 20 header is included in the bag of parts. RS-485 sig-
nals are available on shrouded header J1, and RS-232 signals (Serial Ports C, D, and E) are
available on header J2. A header strip at J2 allows you to connect a ribbon cable. A shrouded
header connector and wiring harness are included with the RCM3700 Development Kit parts
to help you access the RS-485 signals on shrouded header J1.
There is a 2.5" × 3" through-hole prototyping space available on the RCM3700 Prototyping
Board. The holes in the prototyping area are spaced at 0.1" (2.5 mm). +3.3 V, +5 V, and
GND traces run along both edges of the prototyping area for easy access. Small to medium
circuits can be prototyped using point-to-point wiring with 20 to 30 AWG wire between the
prototyping area, the +3.3 V, +5 V, and GND traces, and the surrounding area where sur-
face-mount components may be installed. Small holes are provided around the surface-
mounted components that may be installed around the prototyping area.
B.1.4.1 Adding Other Components
There are two sets of pads for 28-pin devices that can be used for surface-mount prototyp-
ing SOIC devices. (Although the adjacent sets of pads could accommodate up to a 56-pin
device, they do not allow for the overlap between two 28-pin devices.) There are also pads
that can be used for SMT resistors and capacitors in an 0805 SMT package. Each compo-
nent has every one of its pin pads connected to a hole in which a 30 AWG wire can be sol-
dered (standard wire-wrap wire can be soldered in for point-to-point wiring on the
RCM3700 Prototyping Board). Because the traces are very thin, carefully determine
which set of holes is connected to which surface-mount pad.
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RabbitCore RCM3750