EA-OEM-315 Embedded Artists, EA-OEM-315 Datasheet - Page 2

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EA-OEM-315

Manufacturer Part Number
EA-OEM-315
Description
KIT LPC3141 SODIMM 66X48 200POS
Manufacturer
Embedded Artists
Type
MCUr
Datasheet

Specifications of EA-OEM-315

Contents
Board
For Use With/related Products
LPC3141
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
3. Ordering information
Table 1.
Table 2.
LPC3141_3143
Preliminary data sheet
Type number
LPC3141FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 × 12 × 0.8 mm SOT570-3
LPC3143FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 × 12 × 0.8 mm SOT570-3
Type number
LPC3141FET180
LPC3143FET180
Ordering information
Ordering options for LPC3141/3143
3.1 Ordering options
Package
Name
Core/bus
frequency
270/
90 MHz
270/
90 MHz
Operating voltage and temperature
TFBGA180 package: 12
Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
On the LPC3143 only: secure booting using an AES decryption engine from SPI
flash, NAND flash, SD/MMC cards, UART, or USB.
DMA controller
Four 32-bit timers
Watchdog timer
PWM module
Master/slave PCM interface
Random Number Generator (RNG)
General Purpose I/O pins (GPIO)
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Core voltage: 1.2 V
I/O voltages: 1.8 V, 3.3 V
Temperature: −40 °C to +85 °C
Description
Total
SRAM
192 kB
192 kB
All information provided in this document is subject to legal disclaimers.
Security
engine
AES
no
yes
Rev. 0.16 — 27 May 2010
High-speed USB
Device/
Host/OTG
Device/
Host/OTG
x
12 mm, 0.8 mm pitch
10-bit
ADC
channels
4
4
I
I
2 each yes
2 each yes
2
2
S/
C
LPC3141/3143
MCI
SDHC/
SDIO/
CE-ATA
© NXP B.V. 2010. All rights reserved.
Temperature
range
−40 °C to +85 °C
−40 °C to +85 °C
Version
2 of 74

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