KIT908E624DWBEVB Freescale Semiconductor, KIT908E624DWBEVB Datasheet - Page 35

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KIT908E624DWBEVB

Manufacturer Part Number
KIT908E624DWBEVB
Description
KIT EVAL 908E624 TRPL W/MCU/LIN
Manufacturer
Freescale Semiconductor
Type
MCUr

Specifications of KIT908E624DWBEVB

Contents
*
Silicon Manufacturer
Freescale
Core Architecture
HC08
Core Sub-architecture
HC08
Silicon Core Number
MC68HC908
Silicon Family Name
HC08E
For Use With/related Products
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
drawing number below.
Analog Integrated Circuit Device Data
Freescale Semiconductor
Important For the most current revision of the package, visit
27
1
2X 27 TIPS
0.3 A
5.15
PIN 1 INDEX
B C
10.3
7.6
7.4
A
A
B
54
28
B
C
5
4
9
9
0.30
0.25
18.0
17.8
PACKAGING DIMENSIONS
ROTATED 90 CLOCKWISE
B
6
54-TERMINAL SOIC WIDE BODY
SECTION A-A
0.13
PACKAGING
EW SUFFIX (Pb-FREE)
(0.29)
0.38
0.22
CASE 1365-01
M
PLASTIC PACKAGE
°
98ASA99294D
ISSUE O
DWB SUFFIX
A B
ISSUE O
2.65
2.35
(0.25)
www.freescale.com
C
BASE METAL
PLATING
8
C L
54X
A
52X
0.65
0.10
SEATING
PLANE
R0.08 MIN
GAUGE PLANE
0.25
A
and do a keyword search on the 98A
8 °
0 °
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS B AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
MM. DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD SHALL NOT LESS
THAN 0.07 MM.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.1 MM AND 0.3 MM FROM
THE LEAD TIP.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE
BAR BURRS, GATE BURRS AND INTER-LEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
0.9
0.5
SECTION B-B
0 °
MIN
PACKAGING DIMENSIONS
DATE 09/19/01
PACKAGING
0.29
0.13
908E624
35

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