KIT908E624DWBEVB Freescale Semiconductor, KIT908E624DWBEVB Datasheet - Page 37

• Manufacturer Part Number: KIT908E624DWBEVB
• Description: KIT EVAL 908E624 TRPL W/MCU/LIN
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of KIT908E624DWBEVB

• Contents: *
• Silicon Manufacturer: Freescale
• Core Architecture: HC08
• Core Sub-architecture: HC08
• Silicon Core Number: MC68HC908
• Silicon Family Name: HC08E
• For Use With/related Products: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
PTB6/AD6/TBCH0
Material:
Outline:
Area A :
Ambient Conditions: Natural convection, still air
PTB7/AD7/TBCH1
PTD0/TACH0
PTD1/TACH1
PTC2/MCLK
PTC4/OSC1
PTC3/OSC2
PTB5/AD5
PTB4/AD4
PTB3/AD3
PTB1/AD1
PWMIN
RST_A
IRQ_A
RST
HS3
HS2
HS1
IRQ
NC
NC
NC
NC
NC
NC
L1
L2
908E624 Terminal Connections
17.9 mm x 7.5 mm Body
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
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18
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24
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26
27
54-Terminal SOICW
0.65 mm Pitch
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
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48
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Figure 22. Surface Mount for SOIC Wide Body
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
NC
RXD
WDCONF
+E
-E
OUT
VCC
AGND
VDD
NC
VSUP1
GND
LIN
VSUP2
non-Exposed Pad
Table 17. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Resistance
R
Terminal
R
This device is a dual die package. Index m indicates the
θ
JA
θ JA mn
mn
is the thermal resistance between die junction and
Area A
(mm
300
600
A
0
2
)
1 = Power Chip, 2 = Logic Chip (
m = 1,
n = 1
58
56
54
THERMAL ADDENDUM (REV 3.0)
ADDITIONAL DOCUMENTATION
m = 1, n = 2
m = 2, n = 1
48
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45
m = 2,
n = 2
908E624
53
51
50
°
C/W)
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