EVAL-ADM1023EB ON Semiconductor, EVAL-ADM1023EB Datasheet - Page 15

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EVAL-ADM1023EB

Manufacturer Part Number
EVAL-ADM1023EB
Description
BOARD EVAL FOR ADM1023
Manufacturer
ON Semiconductor
Type
Temperature Sensorr
Datasheet

Specifications of EVAL-ADM1023EB

Contents
Evaluation Board
For Use With/related Products
ADM1023
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
current sources, excessive cable and/or filter capacitance
can affect the measurement. When using long cables, the
filter capacitor may be reduced or removed.
resistance introduces about 1°C error.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
*The “Z’’ suffix indicates Pb−Free part.
ORDERING INFORMATION
Specifications Brochure, BRD8011/D.
ADM1023ARQZ
ADM1023ARQZ−REEL
ADM1023ARQZ−R7
Because the measurement technique uses switched
Cable resistance can also introduce errors. A 1 W series
Use wide tracks to minimize inductance and reduce
noise pickup. 10 mil track minimum width and spacing
is recommended.
Try to minimize the number of copper/solder joints,
which can cause thermocouple effects. Where
copper/solder joints are used, make sure that they are in
both the D+ and D− path and at the same temperature.
Thermocouple effects should not be a major problem as
1°C corresponds to about 240 mV, and thermocouple
voltages are about 3 mV/°C of temperature difference.
Unless there are two thermocouples with a big
temperature differential between them, thermocouple
voltages should be much less than 240 mV.
Place a 0.1 mF bypass capacitor close to the V
and 1000 pF input filter capacitors across D+, D− close
to the ADM1023.
If the distance to the remote sensor is more than 8
inches, the use of twisted pair cable is recommended.
This is effective up to approximately 6 to 12 feet.
For longer distances (up to 100 feet), use shielded,
twisted−pair cable such as Belden #8451 microphone
cable. Connect the twisted pair to D+ and D−, and
connect the shield to GND close to the ADM1023.
Leave the remote end of the shield unconnected to
avoid ground loops.
GND
GND
Device Number
D+
D–
Figure 19. Arrangement of Signal Tracks
Temperature Range
0°C to +120°C
0°C to +120°C
0°C to +120°C
10MIL
10MIL
10MIL
10MIL
10MIL
10MIL
10MIL
10MIL
10MIL
10MIL
10MIL
DD
pin
http://onsemi.com
ADM1023
16−Lead QSOP
16−Lead QSOP
16−Lead QSOP
Package Type
15
Application Circuits
ADM1023, using a discrete sensor transistor connected via
a shielded, twisted−pair cable. The pullups on SCLK,
SDATA, and ALERT are required only if they are not
already provided elsewhere in the system.
interfaced directly to the SMBus of an I/O chip. Figure 21
shows how the ADM1023 might be integrated into a system
using this type of I/O controller.
2N3904
Figure 21. System Using ADM1023 and I/O Controller
Figure 20 shows a typical application circuit for the
The SCLK and SDATA pins of the ADM1023 can be
2 USB PORTS
CD ROM
2 IDE PORTS
USB
DISPLAY
DISPLAY
CACHE
USB
1000pF
SHIELD
Figure 20. Typical Application Circuit
HARD
DISK
PROCESSOR
Package Option
CONTROLLER
GND
(FIRMWARE
D+
D–
ADM1023
ICH I/O
GMCH
HUB)
FWH
RQ−16
RQ−16
RQ−16
HUB
ALERT
ADD1
SYSTEM BUS
ADD0
V
DD
0.1μF
PCI BUS
MEMORY
SYSTEM
SUPER I/O
PCI SLOTS
10kΩ 10kΩ
SET TO
REQUIRED
ADDRESS
D–
D+
2500 Tape & Reel
1000 Tape & Reel
Shipping
98 Tube
ADM1023
10kΩ
SMBUS
OUT
I/O
IN
3V
TO 5.5V
TO
CONTROL
CHIP

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