HW-V2PRO-XLVDS Xilinx Inc, HW-V2PRO-XLVDS Datasheet - Page 198

• Manufacturer Part Number: HW-V2PRO-XLVDS
• Description: EVAL BOARD VIRTEX II PRO XLVDS
• Manufacturer: Xilinx Inc
• Series: Virtex™-II Pror
• Type: LVDS Data Transmissionr

Specifications of HW-V2PRO-XLVDS

• Contents: Board, Cables, 4 Clock Source Boards and CD
• For Use With/related Products: XC2VP20
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

R
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF672 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 4: FF672 Flip-Chip Fine-Pitch BGA Package Specifications
FF896 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
9, XC2VP7, XC2VP20, and XC2VP30 Virtex-II Pro devices are available in the FF896 flip-chip fine-pitch
BGA package. Pins in each of these devices are the same, except for differences shown in the "No Connects" column.
Following this table are the
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
pitch).
www.xilinx.com
DS083 (v4.7) November 5, 2007
Module 4 of 4
Product Specification
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