AU016D104KAG2A AVX Corporation, AU016D104KAG2A Datasheet - Page 3

• Manufacturer Part Number: AU016D104KAG2A
• Description: CAP CER .10UF 6.3V X5R GOLD 0201
• Manufacturer: AVX Corporation
• Series: AUr

Specifications of AU016D104KAG2A

• Capacitance: 0.1µF
• Voltage - Rated: 6.3V
• Tolerance: ±10%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: 0201 (0603 Metric)
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Dielectric Characteristic: X5R
• Capacitance Tolerance: ± 10%
• Voltage Rating: 6.3VDC
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Operating Temperature Range: -55°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
(L) Length
(W) Width
(t) Terminal
PREFERRED SIZES ARE SHADED
* Contact factory
32
Thickness
Cap
(pF)
Cap
(μF)
Letter
Max.
Packaging
Soldering
SIZE
SIZE
WVDC
WVDC
(0.013)
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.33
100
120
150
180
220
270
330
390
470
560
680
820
mm
mm
mm
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
0.1
(in.)
(in.)
(in.)
A
10
12
15
18
22
27
33
39
47
56
68
82
25
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
(0.022)
0.56
C
50
50
Paper/Embossed
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Reflow/Epoxy/
(0.126 ± 0.008)
(0.098 ± 0.008)
(0.020 ± 0.010)
Wire Bond*
3.20 ± 0.20
2.50 ± 0.20
0.50 ± 0.25
PAPER
(0.028)
AU10
AU10
0.71
100
100
E
M
M
J
J
J
J
J
J
J
J
J
J
200
200
(0.035)
M
M
M
Q
Q
J
J
J
J
0.90
G
500
500
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
(0.037)
0.94
J
25
25
M
M
M
M
M
M
M
M
M
K
K
K
K
K
K
K
K
K
K
K
K
K
K
(0.040)
50
50
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
1.02
Reflow/Epoxy/
K
All Embossed
(0.177 ± 0.012)
(0.126 ± 0.008)
(0.024 ± 0.014)
Wire Bond*
4.50 ± 0.30
3.20 ± 0.20
0.61 ± 0.36
AU12
AU12
100
100
M
M
M
M
K
K
K
K
K
K
K
K
K
(0.050)
1.27
M
200
200
K
K
K
K
K
P
P
P
P
P
X
(0.055)
1.40
500
500
N
M
M
M
M
P
Q
Q
Q
Q
X
(0.060)
1.52
50
50
EMBOSSED
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
Reflow/Epoxy/
All Embossed
(0.177 ± 0.012)
(0.252 ± 0.016)
(0.024 ± 0.014)
Wire Bond*
(0.070)
4.50 ± 0.30
6.40 ± 0.40
0.61 ± 0.36
1.78
AU13
AU13
Q
100
100
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
(0.090)
2.29
X
200
200
M
M
M
M
M
M
M
M
M
M
M
(0.100)
2.54
Y
50
50
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Q
Q
P
P
P
P
P
(0.110)
2.79
L
Z
Reflow/Epoxy/
All Embossed
(0.225 ± 0.010)
(0.250 ± 0.010)
(0.025 ± 0.015)
Wire Bond*
AU14
5.72 ± 0.25
6.35 ± 0.25
0.64 ± 0.39
100
100
AU14
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
Y
t
W
200
200
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
T