AU016D104KAG2A AVX Corporation, AU016D104KAG2A Datasheet - Page 4

• Manufacturer Part Number: AU016D104KAG2A
• Description: CAP CER .10UF 6.3V X5R GOLD 0201
• Manufacturer: AVX Corporation
• Series: AUr

Specifications of AU016D104KAG2A

• Capacitance: 0.1µF
• Voltage - Rated: 6.3V
• Tolerance: ±10%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: 0201 (0603 Metric)
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Dielectric Characteristic: X5R
• Capacitance Tolerance: ± 10%
• Voltage Rating: 6.3VDC
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Operating Temperature Range: -55°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
(L) Length
(W) Width
(t) Terminal
* Contact factory
Thickness
Cap
(pF)
Cap
(μF
Letter
Max.
Packaging
Soldering
SIZE
= Under Development
SIZE
WVDC
WVDC
0.010
0.015
0.022
0.033
0.047
0.068
1000
1500
2200
3300
4700
6800
(0.013)
0.10
0.15
0.22
0.33
0.47
0.68
100
150
220
330
470
680
100
0.33
1.0
1.5
2.2
3.3
4.7
10
22
47
mm
mm
mm
A
(in.)
(in.)
(in.)
16
16
Reflow/Epoxy
C
C
C
C
(0.040 ± 0.004)
(0.020 ± 0.004)
(0.010 ± 0.006)
Wire Bond*
All Paper
1.00 ± 0.10
0.50 ± 0.10
0.25 ± 0.15
(0.022)
AU02
0.56
AU02
C
25
25
C*
C
C
C
50
50
C
C
C
C
C
C
C
C
C
PAPER
(0.028)
0.71
E
6.3
6.3
G
G
J*
10
10
G
G
G
J*
(0.035)
0.90
G
16
16
J*
G
G
G
Reflow/Epoxy
(0.063 ± 0.006)
(0.032 ± 0.006)
(0.014 ± 0.006)
Wire Bond*
1.60 ± 0.15
0.81 ± 0.15
0.35 ± 0.15
All Paper
AU03
AU03
25
25
G
G
G
G
G
G
J*
(0.037)
0.94
J
50
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
100
G
G
G
G
G
G
G
G
G
G
(0.040)
1.02
K
200
200
G
G
G
G
6.3
6.3
P*
(0.050)
1.27
M
10
10
P*
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Paper/Embossed
(0.055)
16
P*
16
Reflow/Epoxy
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
1.40
(0.079 ± 0.008)
(0.049 ± 0.008)
(0.020 ± 0.010)
Wire Bond*
N
2.01 ± 0.20
1.25 ± 0.20
0.50 ± 0.25
AU05
AU05
25
N*
P*
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
(0.060)
50
50
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
1.52
EMBOSSED
P
100
100
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
(0.070)
200
200
1.78
N
J
J
J
J
J
J
J
J
J
J
J
Q
6.3
6.3
Q*
(0.090)
2.29
10
Q*
Q*
10
M
M
M
P
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
X
16
Q*
Q*
16
M
M
M
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Paper/Embossed
Reflow/Epoxy
(0.100)
(0.126 ± 0.008)
(0.063 ± 0.008)
(0.020 ± 0.010)
Wire Bond*
2.54
3.20 ± 0.20
1.60 ± 0.20
0.50 ± 0.25
25
Q*
25
Y
M
M
Q
Q
Q
Q
AU06
J
J
J
J
J
J
J
J
J
J
J
J
J
J
AU06
50
50
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
(0.110)
2.79
100
100
Z
M
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
200
200
M
M
M
M
J
J
J
J
J
J
P
P
500
500
M
M
M
M
K
K
K
K
P
P
33