0402ZD104KAT2A AVX Corporation, 0402ZD104KAT2A Datasheet - Page 15

• Manufacturer Part Number: 0402ZD104KAT2A
• Description: CAP CERM .1UF 10% 10V X5R 0402
• Manufacturer: AVX Corporation
• Series: 0402r

Specifications of 0402ZD104KAT2A

• Capacitance: 0.1µF
• Package / Case: 0402 (1005 Metric)
• Voltage - Rated: 10V
• Tolerance: ±10%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Thickness: 0.56mm Max
• Tolerance (+ Or -): 10%
• Voltage: 10VDC
• Temp Coeff (dielectric): X5R
• Operating Temp Range: -55C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 1mm
• Product Depth (mm): 0.5mm
• Product Height (mm): 0.56mm
• Product Diameter (mm): Not Requiredmm
• Dielectric Characteristic: X5R
• Capacitance Tolerance: ± 10%
• Voltage Rating: 10VDC
• Capacitor Case Style: 0402
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes
• Case Size: 0402
• Dielectric Strength: No breakdown or visual defects
• Dissipation Factor: 5 %
• Dissipation Factor, Test Condition: (Max.)
• Insulation Resistance: 100000 Megohms
• Length: 0.040 in. ±0.004 in.
• Material, Element: Ceramic
• Package Type: 7 in. Reel
• Temperature, Operating, Maximum: +125 °C
• Temperature, Operating, Minimum: -55 °C
• Termination: SMT
• Voltage, Rating: 10 VDC
• Width: 0.020 in. ±0.004 in.
• Operating Temperature Range: - 55 C to + 85 C
• Temperature Coefficient / Code: X5R
• Product: General Type MLCCs
• Dimensions: 0.5 mm W x 1 mm L x 0.56 mm H
• Dissipation Factor Df: 5
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: RoHS Compliant part
• Other names: 478-1129-2

Surface Mounting Guide
MLC Chip Capacitors
REFLOW SOLDERING
Component pads should be designed to achieve good
solder filets and minimize component movement during
reflow soldering. Pad designs are given below for the most
common sizes of multilayer ceramic capacitors for both
wave and reflow soldering. The basis of these designs is:
WAVE SOLDERING
Component Spacing
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less impor-
tant for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
Component Pad Design
70
Dimensions in millimeters (inches)
D1
D1
D2
D3
D4
D2
D3
D4
D5
≥1.5mm (0.06)
≥1mm (0.04)
≥1mm (0.04)
D5
Dimensions in millimeters (inches)
Case Size
Case Size
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
0603
0805
1206
1.70 (0.07)
2.30 (0.09)
3.00 (0.12)
4.00 (0.16)
4.00 (0.16)
5.60 (0.22)
5.60 (0.22)
5.60 (0.22)
6.60 (0.26)
6.60 (0.26)
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
D1
D1
1.00 (0.04))
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
• Pad width equal to component width. It is permissible to
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
Preheat & Soldering
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
D2
D2
decrease this to as low as 85% of component width but it
is not advisable to go below this.
1.0mm for wave soldering.
0.50 (0.02)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
3.60 (0.14)
3.60 (0.14)
4.60 (0.18)
4.60 (0.18)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
3.60 (0.14)
D3
D3
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
D4
D4
0.50 (0.02)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
2.00 (0.08)
3.00 (0.12)
6.35 (0.25)
5.00 (0.20)
6.35 (0.25)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
D5
D5