C2012X5R0J106M TDK Corporation, C2012X5R0J106M Datasheet - Page 59

• Manufacturer Part Number: C2012X5R0J106M
• Description: CAP CER 10UF 6.3V X5R 20% 0805
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C2012X5R0J106M

• Capacitance: 10µF
• Package / Case: 0805 (2012 Metric)
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Features: Low ESR
• Applications: General Purpose
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 1.25mm
• Tolerance (+ Or -): 20%
• Voltage: 6.3VDC
• Temp Coeff (dielectric): X5R
• Operating Temp Range: -55C to 85C
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Case Style: Ceramic Chip
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Product Height (mm): 1.25mm
• Product Diameter (mm): Not Requiredmm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant
• Other names: 445-1363-2; C2012X5R0J106M; C2012X5R0J106MT; C2012X5R0J106MT

• All specifications are subject to change without notice. Please read the precautions before using the product.
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
General
Specifications
Applied for C0603, C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 1a
Appendix - 2a
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
c
C Series — General Application
C0603
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
c
US Catalog // C Series — General Application // Version A11
Solder Resist
100 mm
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c