NRS5020T150MMGJ Taiyo Yuden, NRS5020T150MMGJ Datasheet - Page 16

• Manufacturer Part Number: NRS5020T150MMGJ
• Description: INDUCTOR 15UH 1.2A 20% SMD
• Manufacturer: Taiyo Yuden
• Series: NRSr
• Type: Ferrite Corer

Specifications of NRS5020T150MMGJ

• Inductance: 15µH
• Current: 1.2A
• Current - Saturation: 1.1A
• Current - Temperature Rise: 1.2A
• Tolerance: ±20%
• Shielding: Shielded
• Dc Resistance (dcr): 198 mOhm Max
• Self Resonant Freq: 20MHz
• Package / Case: 2008 (5020 Metric)
• Mounting Type: Surface Mount
• Operating Temperature: -25°C ~ 120°C
• Frequency - Test: 100kHz
• Material - Core: Ferrite
• Applications: Power Supplies
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Q @ Freq: -
• Other names: 587-2410-2

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Wound Chip power inductor （NR, NS-series）
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
Precautions
Precautions
Precautions
Precautions
Precautions
Precautions
Precautions
1. Circuit Design
2. PCB Design
3. Considerations for automatic placement
4. Soldering
5. Cleaning
6. Handling
7. Storage conditions
Technical
consider-
Technical
consider-
Technical
consider-
Technical
consider-
Technical
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Technical
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For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
PRECAUTIONS
ations
ations
ations
ations
ations
ations
◆Operating environment
◆Land pattern design
◆Land pattern design
◆Adjustment of mounting machine
◆Adjustment of mounting machine
◆Reflow soldering
◆Lead free soldering
◆Recommended conditions for using a soldering iron (NR10050 Type)
◆Reflow soldering
◆Cleaning conditions
◆Cleaning conditions
◆Handling
◆Breakaway PC boards (splitting along perforations)
◆Mechanical considerations
◆Pick-up pressure
◆Packing
◆Breakaway PC boards (splitting along perforations)
◆Mechanical considerations
◆Pick-up pressure
◆Packing
◆Storage
◆Storage
・ Mounting and soldering conditions should be checked beforehand.
・ Applicable soldering process to this products is reflow soldering only.
Surface Mounting
1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems,
1. Please refer to a recommended land pattern.
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.
2. The product shall be used reflow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.
1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering heat, soldering etc
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products.
1. Washing by supersonic waves shall be avoided.
1. if washed by supersonic waves, the products might be broken.
1. Keep the product away from all magnets and magnetic objects.
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.
1. Please avoid accumulation of a packing box as much as possible.
1. The position of the product on PCBs shall be carefully considereed to minimize the stress caused from splitting of the PCBs.
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
1. Damage and a characteristic can vary with an excessive shock or stress.
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of
・ Put the soldering iron on the land-pattern.
・ Soldering iron's temperature - Below 350℃
・ Duration - 3 seconds or less
・ The soldering iron should not directly touch the inductor.
・ Recommended conditions
・NR30/40/50/60/80, NRV30, NRH24/30, NRS40/50/60/80 Type, NR10050, NS12555, NS12565, NS12575 Type
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where
product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
sufficiently.
be controlled.
The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may decrease as time passes.
For this reason, product should be used within 6 months from the time of delivery.
In case of storage over 6 months, solderability shall be checked before actual usage.
taping/packaging materials may take place.
Recommended reflow condition (Pb free solder)
Ambient temperature : －5～40℃
Humidity
300
200
100
0
150∼180
90±30sec
Ｈeating Time 【 sec】
: Below 70% RH
30±10sec
230℃
5sec max
min
Peak ：
250＋5/ー0℃
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