PIC12F635-I/MD Microchip Technology, PIC12F635-I/MD Datasheet - Page 221

• Manufacturer Part Number: PIC12F635-I/MD
• Description: IC PIC MCU FLASH 1KX14 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/MD

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164326 - MODULA SKT PM3 20QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFNAC162057 - MPLAB ICD 2 HEADER 14DIPXLT08DFN - SOCKET TRANSITION ICE 8DFN
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
PIC12F635/PIC16F636/639
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
0°
–
MILLIMETERS
6.40 BSC
0.65 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
–
–
–
–
–
Microchip Technology Drawing C04-087B
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
8°
DS41232D-page 219
φ
L