PIC16F684-I/ST Microchip Technology, PIC16F684-I/ST Datasheet - Page 179

• Manufacturer Part Number: PIC16F684-I/ST
• Description: IC PIC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F684-I/ST

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-TSSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOP
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
E
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
EXPOSED
NOTE 1
A3
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
PAD
1
2
MIN
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.65 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.65
2.65
0.30
0.40
16
–
Microchip Technology Drawing C04-127B
D2
PIC16F684
MAX
1.00
0.05
0.50
2.80
2.80
0.35
–
DS41202F-page 177
L
K
b
e