PIC12C672-10I/P Microchip Technology, PIC12C672-10I/P Datasheet - Page 577

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PIC12C672-10I/P

Manufacturer Part Number
PIC12C672-10I/P
Description
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets

Specifications of PIC12C672-10I/P

Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
128Byte
Cpu Speed
10MHz
No. Of Timers
1
Digital Ic Case Style
DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
DC CHARACTERISTICS
D010
D010A
D010C
D013
D020
D021
D021A
D021B
Note 1: Not Applicable.
Param
Table 30-4: Example DC Characteristics
No.
1997 Microchip Technology Inc.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
and are not tested.
Symbol
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
ization and is for design guidance only. This is not tested.
I
I
DD
PD
Supply Current
Power-down Current
DD
; WDT enabled/disabled as specified.
Section 30. Electrical Specifications
Characteristic
(2,4,5)
DD
DD
measurements in active operation mode are:
/2Rext (mA) with Rext in kOhm.
(3,5)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min Typ† Max Units
22.5
13.5
10.5
2.7
2.0
7.7
7.5
1.5
0.9
1.5
0.9
1.5
13.5
3.8
48
30
42
30
21
24
18
5
5
mA
mA
mA
mA
A
A
A
A
A
A
A
A
0˚C
-40˚C
-40˚C
XT, RC osc configuration (PIC16CXXX-04)
LP osc configuration
INTRC osc configuration,
HS osc configuration (PIC16CXXX-20)
V
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
DD
= 4.0V, WDT enabled, -40 C to +85 C
= 3.0V, WDT enabled, -40 C to +85 C
= 4.0V, WDT disabled, -0 C to +70 C
= 3.0V, WDT disabled, 0 C to +70 C
= 4.0V, WDT disabled, -40 C to +85 C
= 3.0V, WDT disabled, -40 C to +85 C
= 4.0V, WDT disabled, -40 C to +125 C
F
F
F
V
Fosc = 4 MHz, V
Fosc = 20 MHz, V
OSC
OSC
OSC
DD
T
T
T
A
A
A
= 3.0V, WDT disabled
= 4 MHz, V
= 4 MHz, V
= 32 kHz,
+70˚C for commercial and
+85˚C for industrial
+125˚C for extended
DD
Conditions
DD
DD
DD
DD
DD
= 5.5V
= 5.5V
= 3.0V
DS31030A-page 30-7
= 5.5V
and V
SS
.
30

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