PIC18LF24J11-I/ML Microchip Technology, PIC18LF24J11-I/ML Datasheet - Page 14

IC PIC MCU FLASH 16K 2V 28-QFN

PIC18LF24J11-I/ML

Manufacturer Part Number
PIC18LF24J11-I/ML
Description
IC PIC MCU FLASH 16K 2V 28-QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets

Specifications of PIC18LF24J11-I/ML

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC18
No. Of I/o's
16
Ram Memory Size
3776Byte
Cpu Speed
48MHz
No. Of Timers
5
No. Of Pwm
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3776 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
31 KHz
Number Of Programmable I/os
16
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DM183022, DM183033, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
A/d Bit Size
10 bit
A/d Channels Available
10
Height
0.88 mm
Length
6 mm
Supply Voltage (max)
2.75 V, 3.6 V
Supply Voltage (min)
2 V
Width
6 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF24J11-I/ML
Manufacturer:
MICROCHIP
Quantity:
1 400
PIC18F2XJXX/4XJXX FAMILY
3.2.1
The previous programming example assumed that the
device had been Bulk Erased prior to programming. It
may be the case, however, that the user wishes to
modify only a section of an already programmed device.
The appropriate number of bytes required for the erase
buffer must be read out of code memory (as described
in Section 4.2 “Verify Code Memory and Configura-
tion Word”) and buffered. Modifications can be made
on this buffer. Then, the block of code memory that was
read out must be erased and rewritten with the
modified data. The code sequence is shown in
Table 3-4.
TABLE 3-4:
DS39687E-page 14
Step 1: Set the Table Pointer for the block to be erased.
Step 2: Read and modify code memory (see Section 4.1 “Read Code Memory”).
Step 3: Enable memory writes and set up an erase.
Step 4: Initiate erase.
Step 5: Load write buffer. The correct bytes will be selected based on the Table Pointer.
Step 6: Repeat Step 5 for a total of 16 times (if rewriting the entire 1024 bytes of the erase page size).
Step 7: To continue modifying data, repeat Steps 1 through 5, where the Address Pointer is incremented by 1024 bytes at each
iteration of the loop.
Step 8: Disable writes.
Command
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
0000
1101
1111
0000
0000
4-Bit
.
.
.
MODIFYING CODE MEMORY
0E <Addr[21:16]>
6E F8
0E <Addr[8:15]>
6E F7
0E <Addr[7:0]>
6E F6
84 A6
88 A6
82 A6
00 00
0E <Addr[21:16]>
6E F8
0E <Addr[8:15]>
6E F7
0E <Addr[7:0]>
6E F6
<MSB><LSB>
<MSB><LSB>
00 00
94 A6
MODIFYING CODE MEMORY
Data Payload
.
.
.
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
BSF
BSF
BSF
NOP - hold PGC high for time P10.
MOVLW
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
Write 2 bytes and post-increment address by 2.
Repeat write operation 30 more times to fill the write buffer
Write 2 bytes and start programming.
NOP - hold PGC high for time P9.
BCF
<Addr[21:16]>
TBLPTRU
<Addr[8:15]>
TBLPTRH
<Addr[7:0]>
TBLPTRL
EECON1, WREN
EECON1, FREE
EECON1, WR
<Addr[21:16]>
TBLPTRU
<Addr[8:15]>
TBLPTRH
<Addr[7:0]>
TBLPTRL
EECON1, WREN
The WREN bit must be set if the WR bit in EECON1 is
used to initiate a write sequence.
3.2.2
Since the Flash Configuration Words are stored in
program memory, they are programmed as if they were
program data. Refer to Section 3.2 “Code Memory
Programming” and Section 3.2.1 “Modifying Code
Memory” for methods and examples on programming
or modifying program memory. See also Section 5.0
“Configuration Word” for additional information on
the Configuration Words.
Core Instruction
CONFIGURATION WORD
PROGRAMMING
© 2009 Microchip Technology Inc.

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