PIC24FJ256GB110-I/PF Microchip Technology, PIC24FJ256GB110-I/PF Datasheet - Page 314

• Manufacturer Part Number: PIC24FJ256GB110-I/PF
• Description: IC PIC MCU FLASH 256K 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ256GB110-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 256KB (85.5K x 24)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 83
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 84
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24FJ256GB110 FAMILY
TABLE 29-4:
DS39897C-page 314
DC CHARACTERISTICS
Operating Current (I
DC20
DC20a
DC20b
DC20d
DC20e
DC20f
DC23
DC23a
DC23b
DC23d
DC23e
DC23f
DC24
DC24a
DC24b
DC24d
DC24e
DC24f
DC31
DC31a
DC31b
DC31d
DC31e
DC31f
Note 1:
Parameter
No.
2:
3:
4:
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption. The test conditions for all I
with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to V
MCLR = V
operational. No peripheral modules are operating and all of the Peripheral Module Disable (PMD) bits are set.
On-chip voltage regulator disabled (ENVREG tied to V
On-chip voltage regulator enabled (ENVREG tied to V
Detect (BOD) are enabled.
Typical
DC CHARACTERISTICS: OPERATING CURRENT (I
0.83
0.83
0.83
18.2
18.2
18.2
18.2
18.2
18.2
15.0
15.0
20.0
57.0
57.0
95.0
1.1
1.1
1.1
3.3
3.3
3.3
4.3
4.3
4.3
DD
DD
; WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are
)
(1)
(2)
Max
145
1.2
1.2
1.7
1.7
1.7
4.5
4.5
4.5
1.2
24
24
24
24
24
24
54
54
69
96
96
6
6
6
Standard Operating Conditions: 2.0V to 3.6V (unless otherwise stated)
Operating temperature
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
A
A
A
A
A
A
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
-40°C
-40°C
-40°C
-40°C
-40°C
DD
SS
-40°C  T
). Low-Voltage Detect (LVD) and Brown-out
).
DD
measurements are as follows: OSCI driven
A
DD
 +85°C for Industrial
Conditions
)
2.0V
3.3V
2.0V
3.3V
2.5V
3.3V
2.0V
3.3V
 2009 Microchip Technology Inc.
(3)
(4)
(3)
(4)
(3)
(4)
(3)
(4)
LPRC (31 kHz)
DD
16 MIPS
1 MIPS
4 MIPS
.