PIC24HJ256GP610-I/PT Microchip Technology, PIC24HJ256GP610-I/PT Datasheet - Page 6

• Manufacturer Part Number: PIC24HJ256GP610-I/PT
• Description: IC PIC MCU FLASH 128KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ256GP610-I/PT

• Core Size: 16-Bit
• Program Memory Size: 256KB (85.5K x 24)
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b, 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC24
• No. Of I/o's: 85
• Ram Memory Size: 16KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• No. Of Pwm Channels: 8
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 32 Channel)
• A/d Bit Size: 12 bit
• A/d Channels Available: 32
• Height: 1 mm
• Length: 12 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 12 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24HJXXXGPX06/X08/X10
3. Module: 10-bit ADC
TABLE 2:
DS80280G-page 6
Param No.
When the ADC module is configured for 10-bit
operation, the specifications in the data sheet are
not met for operation above 500 ksps.
For 500 ksps, the module meets specifications
except for Gain and Offset parameters AD23bb
and AD24bb.
For 600 ksps operation, the module specifications
are shown in Table 2.
Work around
None. Future versions of the silicon will support
the ADC performance stated in the data sheet.
AD21bb
AD22bb
AD23bb
AD24bb
AD20b
AD21b
AD22b
AD23b
AD24b
AD33b
AD34b
AD56b
AD57b
AD17
600 KSPS OPERATION
Symbol
TSAMP
GERR
GERR
ENOB
EOFF
FNYQ
FCNV
EOFF
DNL
DNL
RIN
ADC Accuracy – Measurements taken with External V
INL
INL
ADC Accuracy – Measurements taken with Internal V
Nr
Min
-1.5
-1.5
8.5
—
—
—
—
—
-2
-2
1
1
1
2
Dynamic Performance
ADC Conversion Rate
Typical
10 bits
3 T
9.7
—
—
—
—
—
—
—
3
2
6
5
AD
Max
200
300
600
9.8
12
10
—
—
2
2
6
5
2
2
REF
REF
+/V
+/V
© 2008 Microchip Technology Inc.
REF
REF
Units
Ohm
ksps
LSB
LSB
LSB
LSB
LSB
LSB
KHz
LSB
LSB
Bits
Bits
—
-
-
Conditions
10-bit
—
—
—
—
—
—
—
—
—
—
—
—
—