PIC18F26J50-I/SP Microchip Technology, PIC18F26J50-I/SP Datasheet - Page 516

• Manufacturer Part Number: PIC18F26J50-I/SP
• Description: IC PIC MCU FLASH 64K 2V 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F26J50-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 16
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2.15 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3776 B
• Interface Type: EUSART/I2C/SPI
• Maximum Clock Frequency: 48 MHz
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136, MA180024, DM183022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 48 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F46J50 FAMILY
FIGURE 29-15:
TABLE 29-22: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)
DS39931C-page 516
70
70A
71
71A
72
72A
73
73A
74
75
76
77
80
81
82
83
Note 1:
Param
No.
Note:
(CKP = 0)
(CKP = 1)
SDI
SDIx
SSx
SCKx
SCKx
SDOx
2:
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
SS
SS
SS
SC
SC
SC
SC
SS
SC
SC
SS
SC
SC
DI
DI
B
DO
DO
DO
DO
Symbol
2
Requires the use of Parameter #73A.
Only if Parameter #71A and #72A are used.
V2
V2
L2
L2
L2
L2WB
H2
H2
L2
H2
L2
Refer to Figure 29-4 for load conditions.
H
L
H2
L2
B
V2
V2
R
F
DO
SC
SC
DO
SS
SC
SC
DI
DO
SS
DO
DI
SC
SC
L
L,
H
H,
L
H,
L
V
V
H,
V,
H,
L
Z
SSx ↓ to SCKx ↓ or SCKx ↑ Input
SSx ↓ to Write to SSPxBUF
SCKx Input High Time
(Slave mode)
SCKx Input Low Time
(Slave mode)
Setup Time of SDIx Data Input to SCKx Edge
Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 T
Hold Time of SDIx Data Input to SCKx Edge
SDOx Data Output Rise Time
SDOx Data Output Fall Time
SSx ↑ to SDOx Output High-Impedance
SDOx Data Output Valid after SCKx Edge
SDOx Data Output Setup to SCKx Edge
SDOx Data Output Valid after SSx ↓ Edge
SSx ↑ after SCKx Edge
EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)
82
70
73
MSb In
MSb
74
71
75, 76
Characteristic
72
bit 6 - - - - - - 1
bit 6 - - - - 1
Continuous
Single byte
Continuous
Single byte
80
LSb
LSb In
1.25 T
1.25 T
1.5 T
3 T
3 T
Min
100
T
40
40
25
CY
35
10
CY
—
—
—
—
—
CY
CY
CY
CY
CY
+ 40
+ 40
+ 30
+ 30
83
© 2009 Microchip Technology Inc.
Max Units
100
25
25
70
50
50
77
—
—
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Note 1)
(Note 1)
(Note 2)
V
V
V
V
V
V
DD
DDCORE
DD
DD
DDCORE
DD
Conditions
= 3.3V,
= 2.15V
= 3.3V,
= 2.15V
= 2.5V
= 2.5V