PIC16LF84-04/SO Microchip Technology, PIC16LF84-04/SO Datasheet - Page 77

• Manufacturer Part Number: PIC16LF84-04/SO
• Description: IC MCU FLASH 1KX14 EE 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF84-04/SO

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16LF
• No. Of I/o's: 13
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 68Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: PIC16LC84A-04/SO

11.1
DC Characteristics
Power Supply Pins
D001
D001A
D002
D003
D004
D010
D010A
D013
D020
D021
D021A
Note 1: This is the limit to which V
Parameter
1998 Microchip Technology Inc.
*
†
No.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DC CHARACTERISTICS:
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula I
V
V
V
S
I
I
DD
PD
Sym
DD
DR
POR
VDD
DD
Supply Voltage
RAM Data Retention
Voltage
V
ensure internal
Power-on Reset signal
V
internal Power-on
Reset signal
Supply Current
Power-down Current
DD
DD
; WDT enabled/disabled as specified.
Characteristic
start voltage to
rise rate to ensure
(1)
R
= V
DD
(2)
DD
DD
can be lowered in SLEEP mode without losing RAM data.
measurements in active operation mode are:
/2Rext (mA) with Rext in kOhm.
(3)
PIC16F84, PIC16F83 (Commercial, Industrial)
0.05*
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0 C
Min
1.5*
4.0
4.5
—
—
—
—
—
—
—
PIC16F83/84
Typ† Max Units
V
1.8
7.3
7.0
1.0
1.0
—
—
—
—
5
SS
6.0
5.5
4.5
—
—
—
10
10
28
14
16
V/ms See section on Power-on Reset for details
mA
mA
mA
V
V
V
V
-40 C
A
A
A
XT, RC and LP osc configuration
HS osc configuration
Device in SLEEP mode
See section on Power-on Reset for details
RC and XT osc configuration
HS osc configuration (PIC16F84-10)
V
V
V
DD
DD
DD
F
F
(During Flash programming)
F
OSC
OSC
OSC
= 4.0V, WDT enabled, industrial
= 4.0V, WDT disabled, commercial
= 4.0V, WDT disabled, industrial
T
T
A
A
= 4.0 MHz, V
= 4.0 MHz, V
= 10 MHz, V
+70 C (commercial)
+85 C (industrial)
DD
Conditions
, T0CKI = V
PIC16F8X
DD
DD
DD
= 5.5V
= 5.5V
= 5.5V
DS30430C-page 77
DD
DD
(4)
,
and V
SS
.