DSPIC33FJ128GP802-I/SO Microchip Technology, DSPIC33FJ128GP802-I/SO Datasheet - Page 372

• Manufacturer Part Number: DSPIC33FJ128GP802-I/SO
• Description: IC DSPIC MCU/DSP 128K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP802-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b, D/A 4x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
TABLE 31-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 31-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70292D-page 372
HSP35
HSP40
HSP41
HSP51
HSP60
Note 1:
CHARACTERISTICS
HSP35
HSP40
HSP41
HSP51
Note 1:
CHARACTERISTICS
Param
Param
No.
No.
2:
2:
AC
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ
AC
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ SSx  to SDO
TssL2doV
Symbol
Symbol
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input to
SCKx Edge
SSx  to SDOx Output
High-Impedance
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
High-Impedance
SDOx Data Output Valid after
SSx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Characteristic
Characteristic
X
Output
(1)
(1)
-40°C  T
-40°C  T
Preliminary
A
Min
Min
A
—
25
25
15
25
25
15
—
—
 +140°C for High Temperature
 +140°C for High Temperature
Typ
Typ
—
—
—
—
—
—
—
—
—
Max
Max
35
—
—
55
35
55
55
—
—
Units
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
 2009 Microchip Technology Inc.
See Note 2
See Note 2
Conditions
Conditions
—
—
—
—
—
—
—