ATMEGA2560V-8AU Atmel, ATMEGA2560V-8AU Datasheet - Page 30

IC AVR MCU 256K 8MHZ 100TQFP

ATMEGA2560V-8AU

Manufacturer Part Number
ATMEGA2560V-8AU
Description
IC AVR MCU 256K 8MHZ 100TQFP
Manufacturer
Atmel
Series
AVR® ATmegar

Specifications of ATMEGA2560V-8AU

Core Processor
AVR
Core Size
8-Bit
Speed
8MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
86
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Processor Series
ATMEGA256x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
8 KB
Interface Type
2-Wire, SPI, USART
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
86
Number Of Timers
6
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
A/d Inputs
16-Channel, 10-Bit
Cpu Speed
8 MIPS
Eeprom Memory
4K Bytes
Input Output
86
Interface
2-Wire/SPI/USART
Memory Type
Flash
Number Of Bits
8
Package Type
100-pin TQFP
Programmable Memory
256K Bytes
Timers
2-8-bit, 4-16-bit
Voltage, Range
1.8-5.5 V
Package
100TQFP
Device Core
AVR
Family Name
ATmega
Maximum Speed
8 MHz
For Use With
ATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK503 - STARTER KIT AVR EXP MODULE 100PATJTAGICE2 - AVR ON-CHIP D-BUG SYSTEM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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10.4
10.5
10.6
10.7
10.8
2549MS–AVR–09/10
ATmega2560 rev. E
ATmega2560 rev. D
ATmega2560 rev. C
ATmega2560 rev. B
ATmega2560 rev. A
2. High current consumption in sleep mode
1. High current consumption in sleep mode
1.
2. Part does not work under 2.4 volts
High current consumption in sleep mode.
Non-Read-While-Write area of flash not functional.
Part does not work under 2.4 volts.
Incorrect ADC reading in differential mode.
Internal ADC reference has too low value.
IN/OUT instructions may be executed twice when Stack is in external RAM.
EEPROM read from application code does not work in Lock Bit Mode 3.
If a pending interrupt cannot wake the part up from the selected sleep mode, the current
consumption will increase during sleep when executing the SLEEP instruction directly after
a SEI instruction.
Problem Fix/Workaround
Before entering sleep, interrupts not used to wake the part from the sleep mode should be
disabled.
No known errata.
Not sampled.
If a pending interrupt cannot wake the part up from the selected sleep mode, the current
consumption will increase during sleep when executing the SLEEP instruction directly after
a SEI instruction.
Problem Fix/Workaround
Before entering sleep, interrupts not used to wake the part from the sleep mode should be
disabled.
Not sampled.
The Non-Read-While-Write area of the flash is not working as expected. The problem is
related to the speed of the part when reading the flash of this area.
Problem Fix/Workaround
- Only use the first 248K of the flash.
- If boot functionality is needed, run the code in the Non-Read-While-Write area at maximum
1/4th of the maximum frequency of the device at any given voltage. This is done by writing
the CLKPR register before entering the boot section of the code.
The part does not execute code correctly below 2.4 volts.
Non-Read-While-Write area of flash not functional
ATmega640/1280/1281/2560/2561
30

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