MAXQ610A-0000+ Maxim Integrated Products, MAXQ610A-0000+ Datasheet - Page 8

• Manufacturer Part Number: MAXQ610A-0000+
• Description: IC MCU 16BIT 64K IR MOD 32TQFN
• Manufacturer: Maxim Integrated Products
• Series: MAXQ™r

Specifications of MAXQ610A-0000+

• Core Processor: RISC
• Core Size: 16-Bit
• Speed: 12MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 32-TQFN Exposed Pad
• Processor Series: MAXQ610
• Core: RISC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: SPI, USART
• Maximum Clock Frequency: 12 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 1.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Controller Family/series: MAXQ
• No. Of I/o's: 24
• Ram Memory Size: 2048Byte
• Cpu Speed: 12MHz
• No. Of Timers: 2
• Embedded Interface Type: JTAG, SPI, USART
• Rohs Compliant: Yes
• Number Of Programmable I/os: 32
• Development Tools By Supplier: MAXQ610-KIT
• Package: 32TQFN EP
• Family Name: MAXQ
• Maximum Speed: 12 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 90-M6800+B01

16-Bit Microcontroller with Infrared Module
8
32 TQFN
14, 30
_______________________________________________________________________________________
1–8
13
EP
29
17
18
31
32
PIN
1, 3, 5–10
40 TQFN
18, 38
17
EP
37
21
22
39
40
IRTXM, RX0,
TX1, TBA0/
P0.0–P0.7;
TX0, RX1,
REGOUT
HFXOUT
NAME
RESET
HFXIN
TBA1,
TBB0/
TBB1
IRRX
GND
IRTX
V
DD
GENERAL-PURPOSE I/O AND SPECIAL FUNCTION PINS
Supply Voltage
Regulator Capacitor. This pin must be connected to ground through a 1.0μF external
ceramic-chip capacitor in series with a 1 resistor. The capacitor must be placed as
close to this pin as
should be connected to this pin.
Ground. The GND contact is through the exposed paddle located on the underside of
the package. It must be directly connected to the ground plane.
Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this pin is low
and begins executing from the reset vector when released. The pin includes pullup
current source and should be driven by an open-drain, external source capable of
sinking in excess of 4mA. This pin is driven low as an output when an internal reset
condition occurs.
High-Frequency Crystal Input. Connect external crystal or resonator between HFXIN
and HFXOUT as the high-frequency system clock. Alternatively, HFXIN is the input
for an external, high-frequency clock source when HFXOUT is floating.
IR Transmit Output. IR transmit pin capable of sinking 25mA. This pin defaults to
high-impedance input with the weak pullup disabled during all forms of reset.
Software must configure this pin after release from reset to remove the high-
impedance input condition.
IR Receive Input. IR receive pin. This pin defaults to high-impedance input with the
weak pullup disabled during all forms of reset. Software must configure this pin after
release from reset to remove the high-impedance input condition.
General-Purpose, Digital, I/O, Type-C Port. These port pins function as bidirectional
I/O pins. All port pins default to high-impedance mode after a reset. Software must
configure these pins after release from reset to remove the high-impedance input
condition. All alternate functions must be enabled from software.
32 TQFN
1
2
3
4
5
6
7
8
IR FUNCTION PINS
POWER PINS
RESET PINS
CLOCK PINS
possible.
40 TQFN
10
1
3
5
6
7
8
9
No other external devices other than the capacitor
PORT
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
Pin Description
SPECIAL FUNCTION
TBA0/TBA1
IRTXM
TBB0
TBB1
RX0
TX0
RX1
TX1