AD8042AN Analog Devices Inc, AD8042AN Datasheet - Page 6

• Manufacturer Part Number: AD8042AN
• Description: IC OPAMP VF R-R DUAL LP 8DIP
• Manufacturer: Analog Devices Inc

Specifications of AD8042AN

• Slew Rate: 225 V/µs
• Rohs Status: RoHS non-compliant
• Design Resources: Single-Ended-to-Differential Converters for Voltage Output and Current Output DACs Using AD8042 (CN0143)
• Amplifier Type: Voltage Feedback
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• -3db Bandwidth: 170MHz
• Current - Input Bias: 1.2µA
• Voltage - Input Offset: 3000µV
• Current - Supply: 6mA
• Current - Output / Channel: 50mA
• Voltage - Supply, Single/dual (±): 3 V ~ 12 V, ±1.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Op Amp Type: Voltage Feedback
• No. Of Amplifiers: 2
• Bandwidth: 160MHz
• Supply Voltage Range: 3V To 12V
• Amplifier Case Style: DIP
• No. Of Pins: 8
• Gain Bandwidth Product: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

AD8042
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range (N, R)
Lead Temperature (Soldering, 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8042 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Exceeding this limit temporarily
can cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
Specification is for the device in free air:
8-Lead PDIP (N)
8-Lead SOIC_N (R)
8-Lead PDIP: θ
8-Lead SOIC_N: θ
JA
= 90°C/W
JA
= 155°C/W.
1
Rating
12.6 V
1.3 W
0.9 W
±V
±3.4 V
Observe Power
Derating Curves
−65°C to +125°C
300°C
S
± 0.5 V
Rev. E | Page 6 of 16
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8042 is internally short-circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the
maximum power derating curves.
ESD CAUTION
2.0
1.5
1.0
0.5
0
Figure 4. Maximum Power Dissipation vs. Temperature
–50
–40
–30
8-LEAD SOIC PACKAGE
–20
–10
AMBIENT TEMPERATURE (°C)
8-LEAD PLASTIC-DIP PACKAGE
0
10
20
30
40
50
60
T
J
= 150°C
70
80
90