LTC2909CTS8-3.3#TRPBF Linear Technology, LTC2909CTS8-3.3#TRPBF Datasheet - Page 15

IC MONITOR PREC 3.3V TSOT23-8

LTC2909CTS8-3.3#TRPBF

Manufacturer Part Number
LTC2909CTS8-3.3#TRPBF
Description
IC MONITOR PREC 3.3V TSOT23-8
Manufacturer
Linear Technology
Type
Multi-Voltage Supervisorr
Datasheet

Specifications of LTC2909CTS8-3.3#TRPBF

Number Of Voltages Monitored
3
Output
Open Drain or Open Collector
Reset
Active Low
Reset Timeout
Adjustable/Selectable
Voltage - Threshold
2.921V, Adj, Adj
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
TSOT-23-8, TSOT-8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC2909CTS8-3.3#TRPBFLTC2909CTS8-3.3
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC2909CTS8-3.3#TRPBFLTC2909CTS8-3.3#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC2909CTS8-3.3#TRPBF
Quantity:
7 500
PACKAGE DESCRIPTIO
2.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
3.85 MAX
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
0.20 BSC
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
2.62 REF
DATUM ‘A’
2.20 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
MAX
0.52
(2 SIDES)
0.50 BSC
PER IPC CALCULATOR
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.30 – 0.50 REF
0.675 ±0.05
PACKAGE
OUTLINE
U
0.65
REF
(SEE NOTE 6)
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702)
(Reference LTC DWG # 05-08-1637)
TOP MARK
1.22 REF
PIN 1 BAR
1.4 MIN
8-Lead Plastic TSOT-23
0.200 REF
0.09 – 0.20
(NOTE 3)
DDB Package
TS8 Package
2.80 BSC
3.00 ±0.10
(2 SIDES)
1.00 MAX
1.50 – 1.75
(NOTE 4)
0.80 – 0.90
0.65 BSC
0.75 ±0.05
2.00 ±0.10
(2 SIDES)
0 – 0.05
PIN ONE ID
0.56 ± 0.05
(2 SIDES)
2.90 BSC
(NOTE 4)
1.95 BSC
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
TS8 TSOT-23 0802
0.01 – 0.10
0.22 – 0.36
8 PLCS (NOTE 3)
8
1
LTC2909
0.50 BSC
0.38 ± 0.10
PIN 1
CHAMFER OF
EXPOSED PAD
(DDB8) DFN 1103
15
2909fb

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