MC33164D-3G ON Semiconductor, MC33164D-3G Datasheet - Page 12

• Manufacturer Part Number: MC33164D-3G
• Description: IC SENSING CIRCUIT UV 3V 8-SOIC
• Manufacturer: ON Semiconductor
• Type: Simple Reset/Power-On Resetr

Specifications of MC33164D-3G

• Number Of Voltages Monitored: 1
• Output: Open Drain or Open Collector
• Reset: Active Low
• Voltage - Threshold: 2.68V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Monitored Voltage: 3 V
• Undervoltage Threshold: 2.71 V
• Overvoltage Threshold: 2.8 V
• Manual Reset: No
• Watchdog: No
• Battery Backup Switching: No
• Power-up Reset Delay (typ): Adj
• Supply Voltage (max): 10 V
• Supply Voltage (min): 1 V
• Supply Current (typ): 24 uA
• Maximum Power Dissipation: 700 mW
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 125 C
• Chip Enable Signals: No
• Internal Hysteresis: Yes
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 125 C
• Output Type: Open Collector / Drain
• Power Fail Detection: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reset Timeout: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC33164D-3G; MC33164D-3GOS

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−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
H
E
e
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D D
A1
A
b
E
8 PL
*For additional information on our Pb−Free strategy and soldering
0.08 (0.003)
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
c
8X
0.041
1.04
6X
M
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.0256
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
T
0.126
0.65
3.20
SOLDERING FOOTPRINT*
B
http://onsemi.com
S
CASE 846A−02
DM SUFFIX
A
ISSUE H
Micro8
L
S
12
0.015
0.38
NOTES:
8X
0.167
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
SCALE 8:1
4.24
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DIM
H
A1
A
D
b
c
E
e
L
E
0.208
5.28
0.05
0.25
0.13
2.90
2.90
0.40
4.75
MIN
−−
inches
mm
MILLIMETERS
0.65 BSC
NOM
0.08
0.33
0.18
3.00
3.00
0.55
4.90
−−
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.15
0.40
0.23
3.10
3.10
0.70
5.05
0.002
0.010
0.005
0.016
0.187
0.114
0.114
MIN
−−
0.026 BSC
INCHES
0.003
0.013
0.007
0.118
0.118
0.021
0.193
NOM
−−
MC34164/D
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
MAX