ADP3335ARMZ-3.3RL7 Analog Devices Inc, ADP3335ARMZ-3.3RL7 Datasheet - Page 5

IC REG LDO 3.3V 500MA 8-MSOP

ADP3335ARMZ-3.3RL7

Manufacturer Part Number
ADP3335ARMZ-3.3RL7
Description
IC REG LDO 3.3V 500MA 8-MSOP
Manufacturer
Analog Devices Inc
Series
anyCAP®r
Datasheet

Specifications of ADP3335ARMZ-3.3RL7

Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Mounting Type
Surface Mount
Current - Output
500mA
Voltage - Output
3.3V
Voltage - Input
Up to 12V
Operating Temperature
-40°C ~ 85°C
Regulator Topology
Positive Fixed
Voltage - Dropout (typical)
0.2V @ 500mA
Number Of Regulators
1
Primary Input Voltage
12V
Output Voltage Fixed
3.3V
Dropout Voltage Vdo
200mV
No. Of Pins
8
Output Current
500mA
Operating Temperature Range
-40°C To +85°C
Msl
MSL 3 - 168 Hours
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADP3335ARMZ-3.3RL7
Manufacturer:
ANALOGPO
Quantity:
3 122
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Table 3. Pin Function Descriptions
Pin No.
1, 2, 3
4
5
6
7, 8
EP
Mnemonic
OUT
GND
NR
SD
IN
Exposed
Pad
Function
Output of the Regulator. Bypass to ground with a 1.0 μF or larger capacitor. All pins must be connected together
for proper operation.
Ground Pin.
Noise Reduction Pin. Used for further reduction of output noise (see the Noise Reduction section for further
details).
Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this
pin should be connected to the input pin.
Regulator Input. All pins must be connected together for proper operation.
The exposed pad on the bottom of the LFCSP package enhances thermal performance and is electrically
connected to the die substrate, which is electrically common with the input pins, IN (Pin 7 and Pin 8), inside the
package.
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
ENHANCES THE THERMAL PERFORMANCE AND IS
ELECTRICALLY CONNECTED TO DIE SUBSTRATE.
THERMAL VIAS MUST BE ISOLATED OR CONNECTED
TO IN. DO NOT CONNECT THE THERMAL PAD TO
GROUND.
OUT
GND
OUT
OUT
GND
OUT
OUT
OUT
1
2
3
4
Figure 3. 8-Lead MSOP
Figure 4. 8-Lead LFCSP
1
2
3
4
Rev. B | Page 5 of 16
(Not to Scale)
(Not to Scale)
ADP3335
ADP3335
TOP VIEW
TOP VIEW
8
7
6
5
8
7
6
5
IN
IN
SD
NR
IN
SD
NR
IN
ADP3335

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