NUP4302MR6T1G ON Semiconductor, NUP4302MR6T1G Datasheet - Page 4

• Manufacturer Part Number: NUP4302MR6T1G
• Description: IC DIODE ARRAY SCHOTTKY TSOP6
• Manufacturer: ON Semiconductor

Specifications of NUP4302MR6T1G

• Voltage - Reverse Standoff (typ): 25V
• Voltage - Breakdown: 30V
• Power (watts): 225mW
• Polarization: 4 Channel Array - Bidirectional
• Mounting Type: Surface Mount
• Package / Case: SC-74-6
• Applications: General Purpose
• Number Of Circuits: 4
• Voltage - Working: 30V
• Technology: Diode Array
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 200 mA
• Configuration: Octal
• Recovery Time: 5 ns
• Forward Voltage Drop: 1 V
• Maximum Reverse Leakage Current: 30 uA
• Maximum Power Dissipation: 225 mW
• Operating Temperature Range: - 55 C to + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Clamping: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: NUP4302MR6T1G; NUP4302MR6T1GOSTR

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0.05 (0.002)
H
E
e
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
0.075
*For additional information on our Pb−Free strategy and soldering
D
1.9
5
2
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
3
4
0.037
0.037
0.95
0.95
b
A
E
SOLDERING FOOTPRINT*
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
http://onsemi.com
L
0.094
CASE 318G−02
2.4
ISSUE P
TSOP−6
c
4
0.039
1.0
q
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. DIMENSIONS A AND B DO NOT INCLUDE
STYLE 12:
DIM
0.028
A1
H
PIN 1. I/O
A
D
q
ANSI Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
b
c
E
e
L
0.7
E
2. GROUND
3. I/O
4. I/O
5. VCC
6. I/O
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
MIN
0°
inches
mm
MILLIMETERS
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
−
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
MIN
0°
NUP4302MR6/D
INCHES
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
NOM
−
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°