B72724A8151V62 EPCOS Inc, B72724A8151V62 Datasheet - Page 22

• Manufacturer Part Number: B72724A8151V62
• Description: VARISTOR ARRAY 14VRMS 0612
• Manufacturer: EPCOS Inc

Specifications of B72724A8151V62

• Package / Case: 0612 (1632 Metric)
• Varistor Voltage: 150V
• Number Of Circuits: 4
• Maximum Ac Volts: 14VAC
• Maximum Dc Volts: 16VDC
• Voltage Rating Dc: 16 V
• Mounting: SMD/SMT
• Voltage Rating Ac: 14 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Energy: -
• Current-surge: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-3429-2; B72724A8151V 62; B72724A8151V062; CA06P4V150THSG

Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer varistors (MLVs)
High-speed series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 22 of 30
As mounted on substrate