PMR50HZPFU5L00 Rohm Semiconductor, PMR50HZPFU5L00 Datasheet - Page 14

• Manufacturer Part Number: PMR50HZPFU5L00
• Description: RES .005 OHM 1W 1% 2010 SMD
• Manufacturer: Rohm Semiconductor
• Series: PMR50r

Specifications of PMR50HZPFU5L00

• Resistance (ohms): 0.005
• Power (watts): 1W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height: 0.020" (0.51mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 2010 (5025 Metric)
• Resistance In Ohms: 0.005
• Case: 2010 (5025 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: PMR50HZPFU5L00; RHM.005ASTR

4. MECHANICAL CHARACTERISTICS
5. TAPE PACKAGING
TSZ22111･05･002
4.1 COVER TAPE PEELING STRENGTH
4.2 Embossed tape should not adhere to top tape when top tape is peeled back, and peel back direction is
4.3 DURABILITY OF COVER TAPE (TOP TAPE)
5.1 Components are set in tape cavities with the same side (resistive paste upside).
5.2 The accumulated pitch tolerance shall be within ±0.2mm at 10 pitches.
5.3 Tape bent resistance
5.4 Components in tape cavity shall not adhere to bottom / cover tape.
5.5 Components shall not be blocked by tape fragments or foreign materials when they are
5.6 The top tape shall not cover up the sprocket holes of tape.
5.7 The number of missing components shall not exceed 0.1% of the total number of components
(marked number) or one whichever is the larger, and no consecutive missing exceeding two is allowed.
: 0.1N ≦ PEELING STRENGTH ≦ 0.8N
as follows.
Top tape shall not be off the base paper after 120hrs at the atmosphere of 60±3℃,90～95%R.H.
No damage on the tape and the cavity when tape is bent with the radius of 15mm.
taken out from cavities.
Em bossed tape
Em bossed tape
PRODUCTS
ULTRA LOW OHMIC RESISTORS
REV.：
about 170°
００８Ｅ
Top tape
Top tape
Feeding direction
Feeding direction
Peel back direction
TYPE
SPECIFICATION No.：ＰＭＲ５０－ＩＡ
Peel back direction
PMR50 Series
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