CPA2512E27R0FS-T10 Susumu, CPA2512E27R0FS-T10 Datasheet

RES 27.0 OHM 16W 1% 2512 SMD

CPA2512E27R0FS-T10

Manufacturer Part Number
CPA2512E27R0FS-T10
Description
RES 27.0 OHM 16W 1% 2512 SMD
Manufacturer
Susumu
Series
CPA2512r
Datasheets
1.CPA2512E82R0FS-T10.pdf (4 pages)
2.CPA2512E82R0FS-T10.pdf (3 pages)

Specifications of CPA2512E27R0FS-T10

Resistance (ohms)
27
Power (watts)
16W
Composition
Thin Film
Temperature Coefficient
±25ppm/°C
Tolerance
±1%
Size / Dimension
0.248" L x 0.126" W (6.30mm x 3.20mm)
Height
0.028" (0.70mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
2512 (6432 Metric)
Resistance In Ohms
27.0
Case
2512 (6432 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
CPA25E27.0TR
Description:
These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A
lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,
much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.
Dimensions:
Electrical Specifications:
Size: Inch (Metric)
Rated Power
Rated Power
Rated Voltage
Resistance Tolerance
Standard Resistance Values (E12)
TCR (ppm/ºC)
Operating Temperature Range
Insulation Resistance (100V, 1min)
Notes:
1. Dependent on effective thermal conductivity/resistance of board construction/land design and size of board - greater power
2. Refer to Thermal Performance Plot below.
3. Per MIL-PRF-55342 (-55/25/125ºC).
4. Per MIL-PRF-55342.
5. Per IEC 60115-1.
6. Derating curves are derived from the thermal performance plots.
Product Family:
Part Number Series:
capability for board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are
capable of generating sufficient heat to reflow solder bonds without device damage.
1, 2
1, 2
3
(Alumina)
(BeO)
Standard
CP*2512,
CP*2525
shown in
image
4
Chip Power Resistor
CP*2512*####FS
5
Construction:
•
•
•
•
Up to 16W
± 50 (Q)
± 25 (E)
to be qualified soon)
99.5% BeO or High Purity Alumina
Nickel alloy thin-film resistive element
Epoxy-resin overcoat
Pre-tinned (Sn100, matte) terminations
over Ni barrier is standard
Call for other sizes and/or termination styles
2512
Call for other values
Inch
Up to 16W
-55 to 155ºC
2512 (6332)
3.3 to 120
√(PxR)
Size
> 1G
± 1%
1, 2
Metric
6332
(Up to 60W
Ω
3.3 to 22
> 22
Ω
1, 2
Ω
6.3 ± 0.2
Ω
L
CPA2512 Derating Curve Examples:
3.2 ± 0.2
W
Standard Dimensions (mm)
Features:
•
•
•
•
•
TCR’s to ± 25ppm/ºC
Tolerances less than ± 1% available
Standard and custom sizes & terminations
available (Sn60Pb40 option)
High volume production, suitable for
commercial and special applications
Competitive pricing
0.7± 0.1
H
Susumu World Group
0.9 ± 0.2
T-top
6
2.0 ± 0.2
T-btm

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CPA2512E27R0FS-T10 Summary of contents

Page 1

... Call for other values ± 25 (E) > 22 Ω ± 50 (Q) 3 Ω -55 to 155ºC > 1G Ω Susumu World Group Features: • TCR’s to ± 25ppm/ºC • Tolerances less than ± 1% available • Standard and custom sizes & terminations available (Sn60Pb40 option) • ...

Page 2

Thermal Performance: Peak Surface Temperature Rise of CPA2512*####*S per Board Thermal Resistance and Applied Power 250 200 150 100 50 0 0.1 P eak Surface Temperature Rise of CP B2512 per Board Thermal Resistance and Applied ...

Page 3

Notes: Plots produced via characterization of thermal coefficients determined from experimental measurements (via thermal imaging camera) at thermal equilibrium with parts mounted to various boards (with homogeneous thermal conductivity to minimize uncertainty) per recommended solder pad dimensions and with boards ...

Page 4

... Orders will be taped as follows; 1000 piece quantity inch reel 5000 piece quantity inch reel See part numbering section for ordering information. Labeling Requirements Labels will contain the TFT part number and quantity of pieces taped. Marking: (Ex. CPA2512E27R0FS-T10) Part Numbering 2512 Product Material ...

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