CPA2512E27R0FS-T10 Susumu, CPA2512E27R0FS-T10 Datasheet - Page 3

• Manufacturer Part Number: CPA2512E27R0FS-T10
• Description: RES 27.0 OHM 16W 1% 2512 SMD
• Manufacturer: Susumu
• Series: CPA2512r

Specifications of CPA2512E27R0FS-T10

• Resistance (ohms): 27
• Power (watts): 16W
• Composition: Thin Film
• Temperature Coefficient: ±25ppm/°C
• Tolerance: ±1%
• Size / Dimension: 0.248" L x 0.126" W (6.30mm x 3.20mm)
• Height: 0.028" (0.70mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 2512 (6432 Metric)
• Resistance In Ohms: 27.0
• Case: 2512 (6432 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Other names: CPA25E27.0TR

Notes:
Recommended Solder Pad Dimensions:
Environmental Performance Specifications:
Test
Life
Thermal Shock
High Temperature Exposure
Short Time Overload
Moisture Resistance
Resistance to Soldering Heat
Solderability
Board Flex
Terminal Strength
Notes:
1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added.
2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H.
3. Parts mounted to boards in accordance with NEMA grade FR-4 of IPC-4101 (62mils thick) with no Cu carrier/heat-sink at a rated
4. Due to the complexity of managing the heat load of hundreds of pieces during qualification, long-term reliability testing for the
Plots produced via characterization of thermal coefficients determined from experimental measurements (via thermal imaging
camera) at thermal equilibrium with parts mounted to various boards (with homogeneous thermal conductivity to minimize
uncertainty) per recommended solder pad dimensions and with boards pressed against a Cu carrier/heat-sink (not ideal) with a
thermal compound interface in a static environment (no air flow).
Heat flow primarily through thickness of board with virtually zero lateral heat transfer in board.
Thermal resistance of test boards were calculated based on material manufacturer specified thermal conductivity (20ºC) via the
following: Thermal Resistance (ºC/W) = L / (k • A), where Thermal Conductivity, k (W/m•K) = (L / (A • ∆T)) • ∆Q/∆t, L =
Thickness of board in meters and A = area of chip resistor in meters (2512 size = 6.3x3.2mm)
The relationships between peak surface temperature rise, power, and board thermal resistance are linear, but the x-axis is plotted
in log-scale to offer greater resolution at lower board thermal resistances.
JESD22-B102D procedure comes from EIA-638, “Surface Mount Solderability Test”.
power of 2W (Board Therm. Res. ~ 72C/W).
16W power rating had been conducted in terms of the equivalent current density via much thinner/narrower resistor patterns to
limit the heat load. Full power testing is being conducted on a smaller scale – to be completed soon.
4
2
4
1
Reference
MIL-PRF-55342,
MIL-STD-202
Method 108A
MIL-PRF-55342,
MIL-STD-202
Method 107G
MIL-PRF-55342
MIL-PRF-55342
MIL-PRF-55342,
MIL-STD-202
Method 106G
MIL-PRF-55342,
MIL-STD-202
Method 210F
MIL-PRF-55342,
MIL-STD-202
Method 208H
IEC 60115-1 /
JIS C 5202
MIL-PRF-55342
Size: Inch (Metric)
Conditions of Test
70ºC, 2000h, rated power
Condition F-3, -65ºC/0.25h to 155ºC/0.25h, 100
cycles
6.25x rated power
25/65/25/65/25/–10ºC, 90% to 98%RH, 10 cycles,
24h/cycle, with and without bias, bias = 1.5h on,
0.5h off @ 1/10
260ºC for 15 sec., over 220ºC for 60 sec., 3 cycles
Precondition E: 150ºC dry bake for 16h,
Method 1 “Dip and Look Test”, 245ºC, 5 sec., Pb-
free (SnAgCu) Solder
Bend amount of 3mm, measurements during and
after bend
155ºC, 100h
Force of 3kg for 30 sec.
A
B
C
th
Standard Dimensions (mm)
rated power
3
, 5 sec.
2512 (6332)
3
, 1.5h on, 0.5h off
1.6
7.7
3.5
3
Requirement
± 0.5% + 0.01
± 0.1% + 0.01
± 0.1% + 0.01
± 0.1% + 0.01
± 0.1% + 0.01
± 0.1% + 0.01
Min 95% coverage
of critical area
± 0.1% + 0.01
No mech. damage
No mech. damage
Ω
Ω
Ω
Ω
Ω
Ω
Ω
,