XRP7604EDB-F Exar Corporation, XRP7604EDB-F Datasheet - Page 11

• Manufacturer Part Number: XRP7604EDB-F
• Description: IC CONV PWM STP-DWN BUCK 8SOIC
• Manufacturer: Exar Corporation
• Type: General Purpose, White LEDr

Specifications of XRP7604EDB-F

• Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
• Constant Current: Yes
• Topology: High Side, PWM, Step-Down (Buck)
• Number Of Outputs: 1
• Internal Driver: Yes
• Type - Primary: General Purpose
• Type - Secondary: White LED
• Frequency: 960kHz ~ 1.55MHz
• Voltage - Supply: 4.5 V ~ 29 V
• Mounting Type: Surface Mount
• Current - Output / Channel: 1A
• Internal Switch(s): Yes
• Efficiency: *
• Low Level Output Current: 1 A
• Operating Supply Voltage: 4.5 V to 29 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 1016-1339-5

DESIGN EXAMPLE
Design a drive circuit for a string of 5 LED at
0.75A with a 24V input voltage. Nominal LED
voltage is 3.3V.
A standard value of 0.27ohm 0805 is selected.
Use a 22uH standard inductor.
A 4.7µF C
From Equ.4, the ripple current rating of C
a fraction of 0.75A. A 4.7uF/25V ceramic
capacitor easily meets this requirement and
offers low ESR and ESL.
LAYOUT CONSIDERATION
i) Place the bypass capacitors C4 and C5 as
close as possible to the XRP7604 IC. See
figure 5 for details.
ii) Create a pad under the IC that connects the
power pad (pin 9) to the inductor. Duplicate
this pad through the pcb layers if present, and
on the bottom side of the PCB. Use multiple
vias to connect these layers to aid in heat
dissipation. Do not oversize this pad - since
the LX node is subjected to very high dv/dt
voltages,
between these islands and the surrounding
circuitry will tend to couple switching noise
iii) Connect the Schottky diode cathode as
close as possible to the LX node and inductor
input side. Connect the anode to a large
diameter trace or a copper area that connects
the input ground to the output ground.
iv) The output capacitor, if used, should be
placed close to the load. Use short wide
© 2009 Exar Corporation
Resistor RFB calculation
Inductor L1 calculation
Input capacitor
L
1
=
(
24
5
×
V
IN
3
×
the
3 .
(C1) is needed (refer to table 1).
RFB
1
V
2 .
)
MHz
×
=
stray
(
24
. 0
0
V
×
2 .
75
(
V
−
0
A
3 .
(
capacitance
5
=
×
×
. 0
. 0
3
3 .
27
75
V
Ω
A
)
)
)
=
1
1
19
A
A
1 .
formed
μ
2
2
H
IN
9
9
V
V
is
11/13
N
N
o
o
n
n
Voltage rating should be 30V. B340A rated at
30V/3A or equivalent can be used for its
ample current rating and low forward voltage.
Use standard resistor value for Rs of 3.4kΩ.
copper regions to connect output capacitors to
load to minimize inductance and resistances.
v) Keep other sensitive circuits and traces
away from the LX node in particular and away
from the power supply completely if possible.
For more detail on the XRP7604 layout see the
XRP7604EVB
available on our web site. Each layer is shown
in detail as well as a complete bill of materials.
-
-
Rs
S
S
Schottky current rating I
Rs calculation
y
y
=
n
n
0
3 .
c
c
I
V
.
.
F
B
−
B
≥
Fig. 17: Circuit for design example
1 (
u
u
Fig. 18: XRP7604 Eval Board
5 .
c
c
1
k
k
×
−
Component Side Lay
. 1
H
(
Evaluation
H
5
15
24
i
i
×
g
×
g
33
3
V
1
h
h
3 .
5 .
μ
A
)
P
×
P
×
. 0
o
o
. 0
75
w
w
75
A
F
e
e
×
A
Board
r
r
. 0
=
X
L
X
L
095
E
E
. 0
R
R
D
D
42
Ω
P
P
Rev. 1.0.0
)
D
D
A
7
7
=
Manual
r
r
6
6
3
i
i
5 .
v
v
0
0
k
e
e
Ω
4
4
r
r