UPC8187TB-EV19 NEC, UPC8187TB-EV19 Datasheet

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UPC8187TB-EV19

Manufacturer Part Number
UPC8187TB-EV19
Description
EVAL BOARD UPC8187TB 1.9GHZ
Manufacturer
NEC
Type
Upconverter, MMICr
Datasheet

Specifications of UPC8187TB-EV19

Frequency
800MHz ~ 2.5GHz
For Use With/related Products
UPC8187TB@1.9GHz
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Document No. P15106EJ2V0DS00 (2nd edition)
Date Published January 2001 N CP(K)
Remark
DESCRIPTION
transceiver. This IC is higher operating frequency, lower distortion and higher conversion gain than conventional
μ PC8163TB.
FEATURES
• High output frequency
• High-density surface mounting : 6-pin super minimold package
• Supply voltage
• Higher IP
APPLICATION
• TDMA, PCS, CDMA etc.
ORDERING INFORMATION
μ PC8187TB-E3-A
The μ PC8187TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless
This IC is manufactured using NEC’s 30 GHz f
P
a
t r
N
To order evaluation samples, please contact your local sales office.
(Part number for sample order: μ PC8187TB-A)
u
3
m
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
SILICON MMIC HI-IP
b
r e
6-pin super minimold
FOR WIRELESS TRANSCEIVER
P
a
k c
BIPOLAR ANALOG INTEGRATED CIRCUIT
: f
: V
: OIP
a
g
RFout
Caution Electro-static sensitive devices
CC
e
The mark
3
= 2.7 to 3.3 V
= 0.8 to 2.5 GHz
= +10 dBm @ f
DATA SHEET
3
FREQUENCY UP-CONVERTER
max
M
a
shows major revised points.
C3G
k r
UHS0 (Ultra High Speed Process) silicon bipolar process.
n i
g
RFout
• Embossed tape 8 mm wide.
• Pin 1, 2, 3 face the tape perforation side.
• Qty 3 kpcs/reel.
= 1.9 GHz
μ μ μ μ PC8187TB
S
u
p
p
y l
n i
g
F
r o
m
©
2000, 2001

Related parts for UPC8187TB-EV19

UPC8187TB-EV19 Summary of contents

Page 1

... The μ PC8187TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver. This IC is higher operating frequency, lower distortion and higher conversion gain than conventional μ PC8163TB. This IC is manufactured using NEC’s 30 GHz f FEATURES • High output frequency • ...

Page 2

... PIN CONNECTIONS.............................................................................................................................3 2. SERIES PRODUCTS............................................................................................................................3 3. BLOCK DIAGRAM ...............................................................................................................................3 4. SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) ...............................................................................................................................................4 5. PIN EXPLANATION..............................................................................................................................5 6. ABSOLUTE MAXIMUM RATINGS......................................................................................................6 7. RECOMMENDED OPERATING RANGE............................................................................................6 8. ELECTRICAL CHARACTERISTICS ....................................................................................................6 9. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY .........................................7 10. TEST CIRCUITS...................................................................................................................................8 10 ...

Page 3

... PIN CONNECTIONS (Top View SERIES PRODUCTS (T = +25° RFout Part Number (mA) (GHz) μ PC8187TB 15 0.8 to 2.5 μ PC8106TB 9 0.4 to 2.0 μ PC8172TB 9 0.8 to 2.5 μ PC8109TB 5 0.4 to.2.0 μ PC8163TB 16.5 0.8 to 2.0 P O(sat) Part Number Note @RF 0.9 GHz @RF 1.9 GHz μ ...

Page 4

SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) Low Noise Tr VCO PLL ÷N 0˚ Phase shifter 90˚ μ PC8187TB Data Sheet P15106EJ2V0DS μ μ μ μ PC8187TB I DEMOD. Q PLL ...

Page 5

PIN EXPLANATION Applied Pin Pin Pin Voltage Voltage No. Name Note (V) (V) 1 IFinput − 1.2 2 GND GND − LOinput − 2 2.7 to 3.3 − RFoutput Same − bias as ...

Page 6

ABSOLUTE MAXIMUM RATINGS Power Dissipation P D Operating Ambient ...

Page 7

OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (T = +25° 2 RFout LOin Parameter Symbol Output 3rd Order Distortion OIP 1 3 Intercept Point OIP 2 3 OIP 3 3 Input 3rd ...

Page 8

... GHz) RFout Strip Line Spectrum Analyzer 100 pF 50 Ω 2 000 000 pF 1 000 pF EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD RFout uPC8187TB COMPONENT LIST Form Symbol Value Chip capacitor 000 100 Chip inductor L 2.2 nH Note 2.2 nH: LL1608-FH2N25 (TOKO Co., Ltd RFoutput IFinput ...

Page 9

... RFout Strip Line Spectrum Analyzer 100 Ω 000 000 pF 1 000 pF EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD RFout uPC8187TB COMPONENT LIST Form Symbol Value Chip capacitor 000 100 0 Chip inductor L 470 nH Note 470 nH: LL2012-FR47 (TOKO Co., Ltd.) 6 RFoutput 1 IFinput 470 GND ...

Page 10

... GHz) RFout Strip Line C Spectrum Analyzer 5 100 Ω 0. 000 000 pF 1 000 pF EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD RFout uPC8187TB COMPONENT LIST Form Symbol Value Chip capacitor 000 100 0. Chip inductor L 470 nH Note 470 nH: LL2012-FR47 (TOKO Co., Ltd RFoutput 1 IFinput 470 ...

Page 11

Caution The test circuits and board pattern on data sheet are for performance evaluation use only (They are not recommended circuits). In the case of actual design-in, matching circuit should be de- termined using S-parameter of desired frequency in accordance ...

Page 12

TYPICAL CHARACTERISTICS (Unless otherwise specified, T CIRCUIT CURRENT vs. SUPPLY VOLTAGE signals +25° +85° –40° 0.0 0.5 ...

Page 13

GHz RFout CONVERSION GAIN vs. LOCAL INPUT POWER 2 150 MHz IFin –5 f LOin P IFin T = +25°C A –10 –30 –20 ...

Page 14

RF OUTPUT POWER OF EACH TONE, IM vs. IF INPUT POWER –10 –20 –30 – – IFin –60 f IFin f –70 LOin P LOin –80 –30 –20 –10 IF Input ...

Page 15

RF OUTPUT POWER OF EACH TONE, IM vs. IF INPUT POWER –10 –20 –30 – –40° 2.8 V – 150 MHz IFin – 151 ...

Page 16

LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 –10 –20 –30 –40 –50 P LOin –60 0 500 1 000 1 500 2 000 2 500 3 000 Local Input Frequency f LOin ...

Page 17

GHz RFout CONVERSION GAIN vs. LOCAL INPUT POWER 2 150 MHz IFin – 750 MHz LOin P = –20 ...

Page 18

RF OUTPUT POWER OF EACH TONE, IM vs. IF INPUT POWER –10 –20 –30 – +25° – 150 MHz IFin – 151 MHz IFin f ...

Page 19

RF OUTPUT POWER OF EACH TONE, IM vs. IF INPUT POWER –10 –20 –30 – –40° 2.8 V – 150 MHz IFin – 151 ...

Page 20

LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 –10 –20 –30 –40 –50 P LOin –60 0 500 1 000 1 500 2 000 2 500 3 000 Local Input Frequency f LOin ...

Page 21

GHz RFout CONVERSION GAIN vs. LOCAL INPUT POWER 3 2 150 MHz IFin – 250 MHz LOin ...

Page 22

RF OUTPUT POWER OF EACH TONE, IM vs. IF INPUT POWER –10 –20 –30 – +25° 2.7 V – 150 MHz IFin – 151 ...

Page 23

RF OUTPUT POWER OF EACH TONE, IM vs. IF INPUT POWER –10 –20 –30 – –40° 2.8 V – 150 MHz IFin – 151 ...

Page 24

LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 –10 –20 –30 –40 –50 P LOin –60 0 500 1 000 1 500 2 000 2 500 3 000 Local Input Frequency f LOin ...

Page 25

S-PARAMETERS FOR EACH PORT (V (The parameters are monitored at DUT pins) LO port REF 1.0 Units 1 200.0 mUnits/ 22.762 Ω –104.25 Ω hp MARKER 1 1.0 GHz MARKER 2 1.75 GHz MARKER 3 2.25 ...

Page 26

... REF 10 –17.772 MARKER 1 830.0 MHz D 1 START 0.330000000 GHz STOP 1.330000000 GHz 2 RFout data are monitored at RF connector on board) 22 1.9 GHz (matched in test circuit REF 1.0 Units 1 200.0 mUnits/ 51.719 Ω 5.6523 Ω MARKER 1 1.9 GHz D START STOP S 22 0.0 dB REF 10 ...

Page 27

GHz (matched in test circuit REF 1.0 Units 1 200.0 mUnits/ 41.41 Ω –3.2695 Ω MARKER 1 2.4 GHz D 1 START 1.900000000 GHz STOP 2.900000000 GHz log MAG S 22 0.0 dB ...

Page 28

PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 28 2.1±0.1 1.25±0.1 0.1 MIN. Data Sheet P15106EJ2V0DS μ μ μ μ PC8187TB ...

Page 29

... Connect a matching circuit to the RF output pin. (5) The DC cut capacitor must be each attached to the input and output pins. 16. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and condi- tions other than those recommended below, contact your NEC sales representative ...

Page 30

... NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • ...

Page 31

Subject: Compliance with EU Dire ctives CEL certifies, to its kno w ledge, that semicondu ctor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical ...

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