TEA5760UK/N1-T ST-Ericsson Inc, TEA5760UK/N1-T Datasheet - Page 33

• Manufacturer Part Number: TEA5760UK/N1-T
• Description: IC FM STEREO RADIO 25-WLCSP
• Manufacturer: ST-Ericsson Inc

Specifications of TEA5760UK/N1-T

• Frequency: 76MHz ~ 90MHz, 87.5MHz ~ 108MHz
• Modulation Or Protocol: FM
• Current - Receiving: 10mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 2.6 V ~ 3.6 V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 25-WLCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Applications: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Other names: 935278949118

NXP Semiconductors
14. Soldering
TEA5760UK_1
Product data sheet
14.1 Introduction to soldering WLCSP packages
14.2 Board mounting
14.3 Reflow soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in Application Note
AN10439 “Wafer Level Chip Scale Package” and in Application Note AN10365 “Surface
mount reflow soldering description” .
Wave soldering is not suitable for this package.
Board mounting of a WLCSP requires several steps:
Key characteristics in reflow soldering are:
Table 31.
Table 32.
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
Rev. 01 — 14 December 2006
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Table 31
13) than a PbSn process, thus
and
220
220
Single chip FM stereo radio
350
32
TEA5760UK
> 2000
260
245
245
© NXP B.V. 2006. All rights reserved.
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