TEA5760UK/N1-T ST-Ericsson Inc, TEA5760UK/N1-T Datasheet - Page 34

• Manufacturer Part Number: TEA5760UK/N1-T
• Description: IC FM STEREO RADIO 25-WLCSP
• Manufacturer: ST-Ericsson Inc

Specifications of TEA5760UK/N1-T

• Frequency: 76MHz ~ 90MHz, 87.5MHz ~ 108MHz
• Modulation Or Protocol: FM
• Current - Receiving: 10mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 2.6 V ~ 3.6 V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 25-WLCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Applications: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Other names: 935278949118

NXP Semiconductors
TEA5760UK_1
Product data sheet
14.3.1 Stand off
14.3.2 Quality of solder joint
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
The stand off between the substrate and the chip is determined by:
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
Fig 13. Temperature profiles for large and small components
•
•
•
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
MSL: Moisture Sensitivity Level
temperature
Figure
Rev. 01 — 14 December 2006
13.
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Single chip FM stereo radio
temperature
TEA5760UK
peak
© NXP B.V. 2006. All rights reserved.
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