TDA7010T3TM ST-Ericsson Inc, TDA7010T3TM Datasheet

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D D ATA SHEET TDA7010T FM radio circuit Product specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS September 1983 ...

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Philips Semiconductors FM radio circuit GENERAL DESCRIPTION The TDA7010T is a monolithic integrated circuit for mono FM portable radios, where a minimum on peripheral components is important (small dimensions and low costs). The IC has an FLL (Frequency-Locked-Loop) system with ...

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Philips Semiconductors FM radio circuit September 1983 Fig.1 Block diagram. 3 Product specification TDA7010T ...

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Philips Semiconductors FM radio circuit RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 4) Oscillator voltage (pin 5) Total power dissipation Storage temperature range Operating ambient temperature range D.C. CHARACTERISTICS 25 °C; measured ...

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Philips Semiconductors FM radio circuit A.C. CHARACTERISTICS = 25 °C; measured in Fig.4 (mute switch open, enabled 4 amb e.m.f.) modulated with ∆f = ±22,5 kHz; f noise voltage measured unweighted (f = 300 ...

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Philips Semiconductors FM radio circuit Fig.3 A.F. output voltage (V ) and total harmonic distortion (THD function of the e.m.f. input voltage (EMF) o with a source impedance (R Conditions mV for ...

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Philips Semiconductors FM radio circuit Fig.4 Test circuit; for printed-circuit boards see Figs 5 and 6. September 1983 7 Product specification TDA7010T ...

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Philips Semiconductors FM radio circuit Fig.5 Track side of printed-circuit board used for the circuit of Fig.4. Fig.6 Component side of printed-circuit board showing component layout used for the circuit of Fig.4. September 1983 8 Product specification TDA7010T ...

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Philips Semiconductors FM radio circuit PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT A A ...

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Philips Semiconductors FM radio circuit SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is ...

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Philips Semiconductors FM radio circuit DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data ...