NTNUS3171PZT5G ON Semiconductor, NTNUS3171PZT5G Datasheet - Page 5

MOSFET P-CH 20V 200MA SOT-1123

NTNUS3171PZT5G

Manufacturer Part Number
NTNUS3171PZT5G
Description
MOSFET P-CH 20V 200MA SOT-1123
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTNUS3171PZT5G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
3.5 Ohm @ 100mA, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
150mA
Vgs(th) (max) @ Id
1V @ 250µA
Input Capacitance (ciss) @ Vds
13pF @ 15V
Power - Max
125mW
Mounting Type
Surface Mount
Package / Case
SOT-1123
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
7 mOhms
Forward Transconductance Gfs (max / Min)
0.26 s
Drain-source Breakdown Voltage
- 20 V
Continuous Drain Current
- 150 A
Power Dissipation
- 125 mW, - 200 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Gate Charge (qg) @ Vgs
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTNUS3171PZT5G
Manufacturer:
ON Semiconductor
Quantity:
2 900
Part Number:
NTNUS3171PZT5G
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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e
c
b1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
1
2
H
D
E
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
L
b
A
E
0.08 (0.0032) X Y
0.25
−Y−
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.35
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
0.90
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 524AA−01
SOT−1123
ISSUE B
DIMENSIONS: MILLIMETERS
5
0.30
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
0.40
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
H
b1
A
D
E
b
c
e
L
E
MIN
0.34
0.15
0.10
0.07
0.75
0.55
0.35
0.95
0.05
MILLIMETERS
NOM
0.37
0.22
0.15
0.12
0.80
0.60
1.00
0.10
−−−
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.40
0.28
0.20
0.17
0.85
0.65
0.40
1.05
0.15
0.013
0.006
0.004
0.003
0.030
0.022
0.014
0.037
0.002
MIN
INCHES
NOM
0.015
0.009
0.006
0.005
0.031
0.024
0.039
0.004
−−−−
NTNUS3171PZ/D
MAX
0.016
0.008
0.007
0.033
0.026
0.016
0.041
0.006
0.011

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