73S8023C-IM/F Maxim Integrated Products, 73S8023C-IM/F Datasheet - Page 27

• Manufacturer Part Number: 73S8023C-IM/F
• Description: IC SMART CARD INTERFACE 32-QFN
• Manufacturer: Maxim Integrated Products
• Type: Smart Card Interfacer

Specifications of 73S8023C-IM/F

• Controller Type: Smart Card Interface
• Interface: *
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Supply: 4.9mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

DS_8023C_019
Revision History
© 2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Rev. 1.5
Revision
1.0
1.1
1.2
1.3
1.4
1.5
Teridian Semiconductor Corp., 6440 Oak Canyon Rd., Suite 100, Irvine, CA 92618
Date
6/13/2005
7/15/2005
12/5/2007
1/17/2008
1/8/2009
4/3/2009
TEL [phone], FAX [phone], http://www.Teridian.com
Description
First publication.
Converted to Teridian format.
Add EMV and ISO logo, remove leaded package option, change 32QFN
punched to SAWN package.
Changed dimension of bottom exposed pad on 32QFN mechanical package
figure.
Added NDS logo to page 1 and assigned document number.
Removed all references to VPC as VPC must be tied to VDD.
73S8023C Data Sheet
27