TEMD6010FX01 Vishay, TEMD6010FX01 Datasheet - Page 3

• Manufacturer Part Number: TEMD6010FX01
• Description: Photodiodes 16V 100mW 540nm
• Manufacturer: Vishay
• Type: Silicon PIN Photodioder

Specifications of TEMD6010FX01

• Photodiode Material: Silicon
• Peak Wavelength: 540 nm
• Maximum Reverse Voltage: 16 V
• Maximum Power Dissipation: 100 mW
• Maximum Light Current: 1 uA
• Maximum Dark Current: 30 nA
• Package / Case: SMD-3
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Wavelength Typ: 540nm
• Half Angle: 60°
• Dark Current: 2nA
• Diode Case Style: 1206
• No. Of Pins: 2
• Operating Temperature Range: -40°C To +100°C
• Msl: MSL 4 - 72 Hours
• Reverse Voltage Vr: 16V
• Wavelength: 540nm
• Output Type: Current On Typ, 1µA
• Photodiode Type: PIN
• Polarity: Forward
• Dark Current (max): 30nA
• Power Dissipation: 100mW
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 3
• Package Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

REFLOW SOLDER PROFILE
PACKAGE DIMENSIONS in millimeters
Document Number: 81308
Rev. 1.5, 24-Sep-09
Fig. 6 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
Fig. 5 - Relative Radiant Sensitivity vs. Angular Displacement
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94 8318
300
250
200
150
100
1.0
0.9
0.8
0.7
50
0
0
0.6
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
0.4
max. 120 s
100
0.2
Time (s)
Drawing-No.: 6.541-5080.01-4
Issue: 1; 31.08.09
21884
0°
150
0
Anode
For technical questions, contact:
max. 100 s
10°
max. 30 s
200
max. 260 °C
20°
250
245 °C
2.4 ± 0.15
4 ± 0.15
300
30°
40°
50°
60°
70°
80°
Ambient Light Sensor
2 ± 0.15
Cathode
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: T
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
Recommended solder pad
Footprint
Not indicated tolerances ± 0.1
1.1
amb
technical drawings
according to DIN
specifications
< 30 °C, RH < 60 %
2.45
Vishay Semiconductors
1.1
TEMD6010FX01
www.vishay.com
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