AH101-G TriQuint, AH101-G Datasheet - Page 5

• Manufacturer Part Number: AH101-G
• Description: RF Amplifier 50.-1500MHz 13.5dB Gain
• Manufacturer: TriQuint
• Type: Gain Amplifierr

Specifications of AH101-G

• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 1500 MHz
• Noise Figure: 3.5 dB @ 800 MHz
• Operating Supply Voltage: 9 V
• Supply Current: 230 mA @ 9 V
• Maximum Operating Temperature: + 160 C
• Minimum Operating Temperature: - 40 C
• Package / Case: SOT-89
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066851

AH101
Medium Power, High Linearity Amplifier
TriQuint Semiconductor, Inc • Phone [phone] • FAX: [phone] • e-mail: [e-mail] • Web site: www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AH101-G (Green / Lead-free SOT-89 Package) Mechanical Information
XXXX-X
101G
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
The AH101-G will be marked with an
“101G” designator.
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package. The obsolete tin-lead package is
marked
followed by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
MSL / ESD Rating
Product Marking
with
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
an
“AH101”
An alphanumeric lot
Ensure that the ground /
designator
May 2009